5SGXMB6R3F40C2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 53248000 597000 1517-FBGA (40x40) |
|---|---|
| Quantity | 1,464 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-FBGA (40x40) | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 225400 | Number of Logic Elements/Cells | 597000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMB6R3F40C2N – Stratix® V GX FPGA, 1517‑FBGA (40×40)
The 5SGXMB6R3F40C2N is a Stratix V GX field-programmable gate array (FPGA) offered in a 1517‑FBGA (40×40) surface-mount package. It delivers high logic density, substantial on-chip memory, and a large I/O count for commercial-grade embedded and high-bandwidth system designs.
With 597,000 logic elements, approximately 53.25 Mbits of embedded memory and 432 user I/Os, this device is targeted at designs that require extensive programmable logic, sizable RAM resources, and dense I/O integration while operating at a core supply range of 870 mV to 930 mV.
Key Features
- Logic Capacity 597,000 logic elements provide high-density programmable logic for complex functions and large-scale implementations.
- Embedded Memory Approximately 53.25 Mbits of on-chip RAM to support large buffers, FIFOs, and data-path storage without external memory for many use cases.
- I/O Density 432 user I/Os enable extensive external interfacing and board-level connectivity for multi-channel systems.
- Power and Core Voltage Core voltage supply specified from 870 mV to 930 mV for defined power-domain design and voltage budgeting.
- Package & Mounting 1517‑FBGA (40×40) package in a surface-mount format for compact, high-density PCB integration.
- Operating Conditions Commercial temperature grade with an operating range of 0 °C to 85 °C for standard commercial applications.
- Compliance RoHS compliant to meet common environmental and regulatory requirements for electronic assemblies.
Typical Applications
- High-density logic and system integration Large logic capacity and on-chip RAM allow integration of complex control, signal-processing, and glue-logic functions into a single device.
- High-bandwidth communications Dense I/O and Stratix V GX family transceiver-capable architecture (as described in the device family documentation) support board designs requiring extensive external connectivity and high data throughput.
- Data-path buffering and packet processing Significant embedded memory combined with large logic resources supports buffering, queuing, and protocol processing tasks in network and compute applications.
Unique Advantages
- Substantial programmable fabric 597,000 logic elements reduce the need for multiple devices by consolidating logic into a single FPGA.
- Large on-chip RAM Approximately 53.25 Mbits of embedded memory minimizes dependency on external RAM for many data-intensive functions.
- High I/O count 432 I/Os simplify board-level routing for multi-channel systems and peripheral-rich designs.
- Compact BGA package 1517‑FBGA (40×40) supports high-density PCB layouts while maintaining robust surface-mount assembly compatibility.
- Commercial‑grade temperature range Specified 0 °C to 85 °C operation for standard commercial deployments and product lines.
- Regulatory readiness RoHS compliance for environmentally conscious manufacturing and procurement.
Why Choose 5SGXMB6R3F40C2N?
The 5SGXMB6R3F40C2N positions itself as a high-capacity, commercially graded Stratix V GX FPGA built for designs that need large programmable logic, significant embedded RAM, and extensive I/O in a compact BGA footprint. Its specified core voltage range and documented operating temperature make it suitable for mainstream commercial applications where consolidation of functionality and dense interfacing are priorities.
Design teams seeking a scalable platform with strong on-chip resources can leverage this device to reduce BOM complexity and centralize processing, buffering, and I/O handling within one programmable device while maintaining RoHS compliance.
Request a quote for 5SGXMB6R3F40C2N to check current pricing and availability for your next design or production run.

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