5SGXMB6R3F40C2N

IC FPGA 432 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 53248000 597000 1517-FBGA (40x40)

Quantity 1,464 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-FBGA (40x40)Number of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs225400Number of Logic Elements/Cells597000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB6R3F40C2N – Stratix® V GX FPGA, 1517‑FBGA (40×40)

The 5SGXMB6R3F40C2N is a Stratix V GX field-programmable gate array (FPGA) offered in a 1517‑FBGA (40×40) surface-mount package. It delivers high logic density, substantial on-chip memory, and a large I/O count for commercial-grade embedded and high-bandwidth system designs.

With 597,000 logic elements, approximately 53.25 Mbits of embedded memory and 432 user I/Os, this device is targeted at designs that require extensive programmable logic, sizable RAM resources, and dense I/O integration while operating at a core supply range of 870 mV to 930 mV.

Key Features

  • Logic Capacity  597,000 logic elements provide high-density programmable logic for complex functions and large-scale implementations.
  • Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support large buffers, FIFOs, and data-path storage without external memory for many use cases.
  • I/O Density  432 user I/Os enable extensive external interfacing and board-level connectivity for multi-channel systems.
  • Power and Core Voltage  Core voltage supply specified from 870 mV to 930 mV for defined power-domain design and voltage budgeting.
  • Package & Mounting  1517‑FBGA (40×40) package in a surface-mount format for compact, high-density PCB integration.
  • Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C for standard commercial applications.
  • Compliance  RoHS compliant to meet common environmental and regulatory requirements for electronic assemblies.

Typical Applications

  • High-density logic and system integration  Large logic capacity and on-chip RAM allow integration of complex control, signal-processing, and glue-logic functions into a single device.
  • High-bandwidth communications  Dense I/O and Stratix V GX family transceiver-capable architecture (as described in the device family documentation) support board designs requiring extensive external connectivity and high data throughput.
  • Data-path buffering and packet processing  Significant embedded memory combined with large logic resources supports buffering, queuing, and protocol processing tasks in network and compute applications.

Unique Advantages

  • Substantial programmable fabric  597,000 logic elements reduce the need for multiple devices by consolidating logic into a single FPGA.
  • Large on-chip RAM  Approximately 53.25 Mbits of embedded memory minimizes dependency on external RAM for many data-intensive functions.
  • High I/O count  432 I/Os simplify board-level routing for multi-channel systems and peripheral-rich designs.
  • Compact BGA package  1517‑FBGA (40×40) supports high-density PCB layouts while maintaining robust surface-mount assembly compatibility.
  • Commercial‑grade temperature range  Specified 0 °C to 85 °C operation for standard commercial deployments and product lines.
  • Regulatory readiness  RoHS compliance for environmentally conscious manufacturing and procurement.

Why Choose 5SGXMB6R3F40C2N?

The 5SGXMB6R3F40C2N positions itself as a high-capacity, commercially graded Stratix V GX FPGA built for designs that need large programmable logic, significant embedded RAM, and extensive I/O in a compact BGA footprint. Its specified core voltage range and documented operating temperature make it suitable for mainstream commercial applications where consolidation of functionality and dense interfacing are priorities.

Design teams seeking a scalable platform with strong on-chip resources can leverage this device to reduce BOM complexity and centralize processing, buffering, and I/O handling within one programmable device while maintaining RoHS compliance.

Request a quote for 5SGXMB6R3F40C2N to check current pricing and availability for your next design or production run.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up