5SGXMB6R3F40C2LG

IC FPGA 432 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 53248000 597000 1517-FBGA (40x40)

Quantity 576 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-FBGA (40x40)Number of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs225400Number of Logic Elements/Cells597000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB6R3F40C2LG – Stratix® V GX Field Programmable Gate Array (FPGA)

The 5SGXMB6R3F40C2LG is a Stratix V GX Field Programmable Gate Array (FPGA) IC in a 1517‑FBGA (40×40) package designed for commercial applications. It provides very large logic capacity, substantial on‑chip memory, and a high count of I/O to support complex, I/O‑dense system designs.

Key Features

  • Logic Capacity  Approximately 597,000 logic elements, supporting large-scale combinational and sequential logic implementations.
  • Embedded Memory  Approximately 53.25 Mbits of embedded memory for on‑chip buffering, state storage, and data manipulation.
  • I/O Density  432 device I/Os to support wide parallel interfaces and multiple high‑pin connectivity requirements.
  • Package & Mounting  1517‑FBGA (40×40) package in a surface‑mount form factor suited for compact PCB designs.
  • Power Envelope  Core supply range of 820 mV to 880 mV, enabling defined power and system supply planning.
  • Temperature Grade  Commercial grade operation with specified operating temperature from 0°C to 85°C.
  • Compliance  RoHS compliant, meeting standard environmental and material requirements for commercial electronics.

Typical Applications

  • Large‑scale digital systems  Designs that require extensive combinational and sequential logic thanks to the FPGA’s ~597,000 logic elements.
  • On‑chip buffering and data handling  Applications that benefit from approximately 53.25 Mbits of embedded memory for packet buffering, FIFOs, or local data storage.
  • I/O‑intensive interfaces  Systems needing high pin counts and parallel connectivity with up to 432 I/Os.
  • Compact surface‑mount designs  Board layouts constrained by space that require a high‑capacity FPGA in a 1517‑FBGA (40×40) surface‑mount package.

Unique Advantages

  • High integration density: The combination of ~597,000 logic elements and ~53.25 Mbits of embedded memory reduces reliance on external logic and memory components.
  • I/O scalability: 432 device I/Os provide flexibility to interface with multiple peripherals, parallel buses, or wide data paths without external multiplexing.
  • Predictable power planning: A defined core voltage range (820 mV–880 mV) simplifies power‑supply design and thermal budgeting.
  • Commercial temperature suitability: Rated for 0°C to 85°C operation to match standard commercial deployment environments.
  • RoHS compliance: Material compliance for environmentally conscious manufacturing and assembly processes.

Why Choose 5SGXMB6R3F40C2LG?

The 5SGXMB6R3F40C2LG positions itself as a high‑capacity, commercially graded Stratix V GX FPGA for designs that require a large logic fabric, significant embedded memory, and substantial I/O. Its surface‑mount 1517‑FBGA package and defined supply and temperature ranges allow engineering teams to integrate a high‑performance FPGA into space‑constrained, commercially targeted products with predictable electrical and thermal characteristics.

Choose this device when your design needs a scalable, highly integrated programmable logic solution with clear electrical parameters and broad connectivity to support complex digital systems.

Request a quote or submit an inquiry to initiate availability and pricing information for the 5SGXMB6R3F40C2LG.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up