5SGXMB6R2F43I3LN

The 5SGXMB6R2F43I3LN is an Intel Stratix® V GX field programmable gate array (FPGA) in a 1760‑ball FCBGA package. It offers very large programmable logic capacity, substantial on‑chip memory, and a high I/O count for demanding embedded and system designs.

Designed and specified for industrial operation, this device targets high‑density FPGA applications that require extensive logic resources, abundant embedded RAM, and broad I/O connectivity while operating from a low core voltage range.

Key Features

• Logic Capacity — Provides 597,000 logic elements for implementing large, complex digital designs and configurable datapaths.
• Embedded Memory — Includes approximately 53.25 Mbits of embedded memory for FIFOs, frame buffers, and on‑chip data storage.
• I/O Density — Up to 600 I/O pins to support extensive external interfaces and board-level connectivity.
• Package — 1760‑FCBGA package (42.5 × 42.5 mm) in a ball‑grid array format optimized for surface‑mount assembly.
• Power — Core supply voltage range specified at 820 mV to 880 mV, enabling low‑voltage core operation.
• Temperature and Grade — Industrial temperature grade with operating range from −40 °C to 100 °C for deployment in harsher environments.
• Mounting — Surface mount device suitable for standard PCB assembly processes.
• Compliance — RoHS‑compliant for environmental and regulatory conformity.

Typical Applications

• High‑performance logic and signal processing — Large logic capacity and significant on‑chip RAM support compute‑intensive data paths and DSP pipelines.
• Communications and networking systems — High I/O count and Stratix V GX family attributes fit systems requiring extensive external interface routing and data buffering.
• Industrial control and automation — Industrial temperature rating and robust package make the device suitable for factory automation and process control equipment.

Unique Advantages

• Massive programmable capacity: 597,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing system complexity.
• Substantial on‑chip RAM: Approximately 53.25 Mbits of embedded memory minimizes external memory dependence for many buffering and storage needs.
• Extensive external connectivity: 600 I/O pins provide flexibility for multi‑channel interfaces, mezzanine connections, and board‑level integration.
• Industrial robustness: Rated for −40 °C to 100 °C operation to support deployments in temperature‑challenging environments.
• Compact high‑pin package: 1760‑FCBGA (42.5 × 42.5 mm) balances pin density and package footprint for high‑density PCB designs.
• Low core‑voltage operation: Core supply between 820 mV and 880 mV supports designs targeting lower power domains.

Why Choose 5SGXMB6R2F43I3LN?

This Intel Stratix V GX FPGA delivers a combination of high logic density, large embedded memory, and a high I/O count in an industrial‑grade FCBGA package. It is well suited for system designers who need to integrate complex logic, on‑chip buffering, and substantial external interfacing within a single FPGA device while maintaining operation across an extended temperature range.

Choose 5SGXMB6R2F43I3LN for designs that require scalable programmable resources, robust industrial operation, and a compact, high‑pin‑count package to simplify board-level integration and reduce system BOM.

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