5SGXMB6R2F43I3LG

The Intel Stratix® V GX Field Programmable Gate Array (FPGA) 5SGXMB6R2F43I3LG is an industrial-grade, high-density programmable logic device in a 1760-FCBGA (42.5 × 42.5 mm) package. It delivers large on-chip logic and embedded memory capacity alongside a high I/O count, making it appropriate for complex, I/O-rich designs that require significant programmable logic and memory resources.

As a member of the Stratix V GX family, the device is part of a series documented for its electrical and switching characteristics, including transceiver capability and core/periphery performance as described in the Stratix V device datasheet.

Key Features

• Core logic density — 597,000 logic elements providing substantial programmable logic capacity for complex designs.
• Logic block count — 225,400 logic blocks available for partitioning and architectural flexibility within designs.
• Embedded memory — approximately 53.25 Mbits of on-chip RAM for buffering, state storage, and data-path implementations.
• High I/O count — 600 user I/Os to support wide parallel interfaces and multiple peripherals.
• Package and mounting — 1760-FCBGA (42.5 × 42.5 mm) surface-mount package for high-pin-count board integration.
• Voltage supply — core voltage range of 820 mV to 880 mV to align with modern FPGA core power domains.
• Industrial operating range — rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Standards compliance — RoHS compliant.
• Family-level transceiver capability — Stratix V GX family documentation lists transceiver speed grades (family-level information includes options up to 14.1 Gbps as shown in the device datasheet).

Typical Applications

• High-density programmable logic systems — for designs that require hundreds of thousands of logic elements to implement complex state machines, custom datapaths, and large combinational/sequential logic blocks.
• Memory-centric designs — where tens of megabits of on-chip RAM reduce external memory dependence for buffering, FIFOs, or lookup tables.
• I/O-intensive systems — boards or modules requiring large parallel or multiplexed interfaces supported by 600 available I/Os.

Unique Advantages

• Substantial programmable capacity: 597,000 logic elements enable large, highly integrated FPGA designs without splitting functions across multiple devices.
• Significant embedded memory: approximately 53.25 Mbits of on-chip RAM reduces external memory needs and simplifies board-level design.
• High I/O availability: 600 I/Os support complex multi-interface systems and parallel data paths.
• Industrial temperature rating: specified operation from −40 °C to 100 °C for use in industrial operating environments.
• High-pin-count FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) provides a compact footprint for integrating a large number of signals on complex PCBs.
• Family-level performance documentation: Stratix V device datasheet provides electrical, switching, and transceiver characteristic details to guide system integration.

Why Choose 5SGXMB6R2F43I3LG?

The 5SGXMB6R2F43I3LG offers a combination of high logic density, substantial on-chip memory, and a large I/O count in an industrial-grade Stratix V GX device package. This combination is tailored for engineers developing complex, I/O-heavy systems that need substantial programmable resources while operating across a wide industrial temperature range.

Designed as part of the Stratix V family, the device is supported by detailed electrical and switching characteristic documentation, allowing engineering teams to evaluate core, periphery, and transceiver behavior during system design and integration.

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