5SGXMB6R3F40C2G

The 5SGXMB6R3F40C2G is a Stratix V GX family FPGA in a 1517-FBGA (40×40) package designed for high-density programmable logic applications. It provides a large logic and memory footprint together with extensive I/O, making it suitable for complex digital designs that require substantial on-chip resources.

As a commercial-grade FPGA, this device offers deterministic operating conditions with a documented core voltage range and temperature window, and it is RoHS compliant.

Key Features

• Logic Capacity  Approximately 597,000 logic elements, enabling large-scale logic integration and complex implementation of custom functions.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM (53,248,000 total RAM bits) for buffering, packet storage, and algorithmic state.
• I/O Resources  432 I/O pins to support dense interfacing with peripherals, high-pin-count daughtercards, and multi-channel I/O requirements.
• Package  1517-FBGA (40×40) supplier device package, surface-mount mounting type for compact board integration.
• Power and Core Voltage  Documented core supply window from 870 mV to 930 mV to define target power delivery design and decoupling strategy.
• Temperature Grade  Commercial operating temperature range: 0 °C to 85 °C, suitable for standard commercial deployments.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly and use.

Typical Applications

• High-density digital processing  Large logic capacity and embedded RAM make the device suitable for compute- and control-heavy FPGA implementations.
• Multi-channel I/O aggregation  With 432 I/Os, the FPGA can consolidate numerous parallel interfaces or handle multi-lane front-end connectivity.
• Custom protocol and interface bridging  Use the available logic and memory to implement protocol translators and interface adaptors within a compact FBGA footprint.

Unique Advantages

• Substantial on-chip resources: The combination of ~597k logic elements and ~53.25 Mbits of RAM reduces reliance on external logic and memory, simplifying system BOM.
• High I/O count: 432 I/Os provide flexibility for dense board-level connectivity and multiple peripheral interfaces without extra bridge devices.
• Compact package: 1517-FBGA (40×40) surface-mount package enables high-density PCB layouts and small form-factor system designs.
• Defined power envelope: Core voltage specification (870 mV–930 mV) supports precise power-supply planning and thermal considerations.
• Commercial readiness: 0 °C to 85 °C operating range and RoHS compliance align with standard commercial product requirements.

Why Choose 5SGXMB6R3F40C2G?

The 5SGXMB6R3F40C2G delivers a high-density Stratix V GX FPGA fabric with a large logic element count, substantial embedded memory, and a high I/O pin count in a compact 1517-FBGA package. Its documented voltage and temperature specifications and RoHS compliance make it a practical choice for commercial designs that require significant on-chip resources and predictable operating conditions.

This device is appropriate for engineering teams implementing complex, resource-intensive FPGA designs who need a documented datasheet and a proven family architecture to guide system-level power and thermal planning.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXMB6R3F40C2G.