5SGXMB6R3F40C2LN

IC FPGA 432 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 53248000 597000 1517-FBGA (40x40)

Quantity 142 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-FBGA (40x40)Number of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs225400Number of Logic Elements/Cells597000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB6R3F40C2LN – Stratix® V GX FPGA, 1517-FBGA (40×40)

The 5SGXMB6R3F40C2LN is a Stratix® V GX field programmable gate array (FPGA) in a 1517-FBGA (40×40) package. It provides a high-density programmable fabric with 597,000 logic elements and approximately 53 Mbits of embedded RAM for complex digital designs.

Designed for commercial-grade applications, this surface-mount FPGA offers a 432-pin I/O count, low-voltage core operation, and RoHS compliance for straightforward integration into board-level systems.

Key Features

  • Core Logic 597,000 logic elements to implement large-scale combinational and sequential logic functions.
  • Embedded Memory Approximately 53 Mbits of on-chip RAM for data buffering, FIFOs, and memory-intensive logic.
  • I/O Density 432 available I/O pins to support wide bus interfaces and multiple external peripherals.
  • Power and Voltage Core supply range of 820 mV to 880 mV to match low-voltage system rails and power budgets.
  • Package and Mounting 1517-FBGA (40×40) package, surface-mount for high-density PCB assembly.
  • Operating Conditions Commercial temperature grade rated for 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic capacity: 597,000 logic elements enable implementation of complex RTL, integration of multiple functions, and consolidation of discrete components into a single FPGA.
  • Substantial embedded memory: Approximately 53 Mbits of on-chip RAM reduce the need for external memory for many buffering and storage tasks.
  • Ample I/O availability: 432 I/Os provide flexibility for interfacing with numerous high-pin-count peripherals and parallel buses.
  • Low-voltage core operation: 820–880 mV supply range helps align with modern low-voltage system architectures and power-optimized designs.
  • Compact BGA package: 1517-FBGA (40×40) supports high-density PCB layouts while maintaining robust mechanical and thermal characteristics for commercial applications.
  • Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial deployments.

Why Choose 5SGXMB6R3F40C2LN?

The 5SGXMB6R3F40C2LN balances high programmable logic capacity and significant embedded memory in a compact 1517-FBGA package, making it suitable for dense, board-level digital systems that require substantial on-chip resources. Its 432 I/Os and low-voltage core range support flexible integration into contemporary designs while maintaining RoHS compliance and commercial temperature operation.

This part is well suited to development teams and procurement groups looking for a high-density Stratix® V GX FPGA with verifiable on-chip resources and standard commercial-grade specifications, backed by documented Stratix V device electrical characteristics.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXMB6R3F40C2LN.

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