5SGXMB6R3F40C3G

The 5SGXMB6R3F40C3G is an Intel Stratix V GX series FPGA supplied in a 1517‑FBGA (40×40) surface‑mount package. It delivers large on‑chip logic and memory resources with 597,000 logic elements and approximately 53 Mbits of embedded RAM, plus a 432‑pin I/O count for complex system integration.

Specified for commercial operation (0 °C to 85 °C) and a core supply range of 820 mV to 880 mV, this device is targeted at high‑density, high‑integration FPGA designs that require extensive logic, memory, and I/O resources in a compact BGA footprint. The device is RoHS‑compliant.

Key Features

• Core logic density  Provides 597,000 logic elements to support large-scale programmable logic implementations and complex custom architectures.
• Embedded memory  Approximately 53 Mbits of on‑chip RAM to handle buffering, LUTs, and data storage without external memory in many designs.
• I/O capability  432 user I/O pins for broad connectivity to peripherals, memory, and high‑speed interfaces.
• Stratix V GX family  Part of the Stratix V GX lineup, supporting the GX class transceiver architecture described in the device family datasheet for high‑speed serial applications.
• Power and core voltage  Core supply range of 820 mV to 880 mV to match system power‑domain requirements and power‑delivery designs.
• Package and mounting  1517‑FBGA (40×40) surface‑mount package for compact board layouts and dense system integration.
• Commercial grade  Rated for 0 °C to 85 °C operation, suitable for commercial applications and environments within this range.
• Compliance  RoHS‑compliant manufacturing.

Typical Applications

• High‑density digital processing  Use the 597,000 logic elements and large embedded RAM for complex signal processing, compute offload, and algorithm acceleration.
• High‑speed serial connectivity  As part of the Stratix V GX family, the device supports designs that implement GX transceiver channels for multi‑Gbps serial links and protocol bridging.
• Large I/O integration  With 432 I/O pins, integrate multiple peripherals, ADCs/DACs, memory interfaces, and control buses on a single FPGA device.
• Compact system designs  The 1517‑FBGA (40×40) package enables dense board layouts where large logic and memory resources are required in a small form factor.

Unique Advantages

• High logic capacity:  597,000 logic elements allow implementation of complex, large‑scale programmable functions without partitioning across multiple devices.
• Substantial on‑chip RAM:  Approximately 53 Mbits of embedded memory reduces dependence on external memory for buffering and intermediate storage.
• Extensive I/O:  432 user I/O pins simplify system integration by providing direct connections for many peripherals and interfaces.
• Compact BGA package:  1517‑FBGA (40×40) provides a small PCB footprint while maintaining high pin count for dense designs.
• Commercial temperature rating:  Specified operation from 0 °C to 85 °C for mainstream electronic products and systems.
• RoHS compliance:  Manufactured to meet RoHS requirements for lead‑free assemblies.

Why Choose 5SGXMB6R3F40C3G?

The 5SGXMB6R3F40C3G delivers a combination of large logic capacity, substantial embedded memory, and extensive I/O in a compact 1517‑FBGA package, making it suitable for complex FPGA designs that require high integration within a limited board area. Its core voltage range and commercial temperature rating provide clear electrical and environmental parameters for system design.

As a member of the Intel Stratix V GX family, this device is supported by comprehensive device documentation and electrical specifications, enabling engineering teams to plan power, timing, and I/O implementation with the documented device characteristics.

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