5SGXMB6R3F40C3N

The 5SGXMB6R3F40C3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1517-FBGA (40×40) surface-mount package. This commercial-grade device delivers high logic capacity, substantial on‑chip RAM, and a large number of I/O pins for dense, I/O‑intensive digital designs.

Targeted at designs that require significant programmable logic and embedded memory in a compact BGA package, the device operates from 820 mV to 880 mV and is rated for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Core / Logic Capacity 597,000 logic elements for implementing complex digital functions and high-density logic designs.
• Embedded Memory Approximately 53.25 Mbits of on‑chip RAM to support memory‑intensive algorithms and buffering on‑chip.
• I/O and Packaging 432 I/O pins in a 1517‑FBGA (40×40) surface‑mount package to support extensive external interfacing and high pin count systems.
• Power Core voltage supply range of 820 mV to 880 mV for the device core.
• Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance RoHS‑compliant for environmental and manufacturing considerations.

Typical Applications

• High‑density digital processing — Use the large logic capacity and embedded RAM for custom signal processing and compute‑intensive logic.
• I/O‑intensive systems — 432 I/Os enable complex board-level interfacing, protocol bridging, and multi-channel connectivity.
• Embedded memory‑centric designs — Approximately 53.25 Mbits of on‑chip RAM supports buffering, packet storage, and state machines without external memory.

Unique Advantages

• High logic density: 597,000 logic elements allow large, consolidated designs and reduce the need for multiple FPGAs.
• Significant on‑chip memory: Approximately 53.25 Mbits of embedded RAM supports data‑intensive functions on chip, simplifying board design.
• Extensive I/O count: 432 I/Os provide flexibility for interfacing with multiple peripherals, sensors, and high‑pin‑count systems.
• Compact BGA package: 1517‑FBGA (40×40) surface‑mount packaging packs high capability into a compact footprint for space‑constrained designs.
• Commercial operating range: Rated for 0 °C to 85 °C, suitable for standard commercial applications.
• RoHS compliant: Meets environmental requirements for lead‑free manufacturing.

Why Choose 5SGXMB6R3F40C3N?

As a Stratix V GX family FPGA from Intel, the 5SGXMB6R3F40C3N combines large programmable logic capacity, substantial embedded memory, and a high I/O count in a single commercial‑grade package. It is well suited for engineers and designers who require dense logic implementation, significant on‑chip RAM, and broad external connectivity in a compact surface‑mount BGA.

The device’s specification sheet and commercial grade make it an appropriate option for production systems that rely on documented electrical characteristics and operating conditions. Its combination of resources supports scalable, consolidated designs where reducing board complexity and external components is a priority.

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