5SGXMB6R3F40C4G

IC FPGA 432 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 53248000 597000 1517-FBGA (40x40)

Quantity 1,274 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-FBGA (40x40)Number of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs225400Number of Logic Elements/Cells597000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB6R3F40C4G – Stratix® V GX FPGA, 597,000 Logic Elements, 432 I/Os, 1517-FBGA (40×40)

The 5SGXMB6R3F40C4G is a Stratix V GX field programmable gate array (FPGA) from Intel, delivered in a 1517‑FBGA (40×40) surface-mount package. It provides very large logic capacity and substantial on‑chip memory for complex, high‑density digital designs within commercial temperature ranges.

This device is part of the Stratix V GX family; the family-level documentation covers electrical and switching characteristics, including transceiver and I/O timing information relevant to system design and integration.

Key Features

  • High logic capacity — 597,000 logic elements to implement large-scale, highly parallel digital logic and custom hardware accelerators.
  • Significant embedded memory — approximately 53.25 Mbits of on‑chip RAM for buffering, lookup tables, and state storage.
  • Extensive I/O — 432 device I/Os to support dense external interfaces and large multi‑channel systems.
  • Power supply — specified core voltage range from 820 mV to 880 mV for core power planning and regulator selection.
  • Commercial temperature grade — rated for operation from 0 °C to 85 °C for standard commercial applications.
  • Package and mounting — 1517‑FBGA (40×40) surface‑mount package for compact, board‑level integration.
  • RoHS compliant — meets RoHS requirements for lead‑free system designs.

Typical Applications

  • Complex FPGA-based systems — suited for designs that need up to 597,000 logic elements and large embedded memory resources.
  • High I/O-count systems — ideal where up to 432 I/Os are required for connectivity to multiple peripherals, sensors, or parallel interfaces.
  • Commercial electronic equipment — targeted for commercial-grade products operating within 0 °C to 85 °C.

Unique Advantages

  • Large programmable fabric: Enables implementation of complex algorithms and wide datapaths thanks to nearly 600k logic elements.
  • Substantial on‑chip memory: Approximately 53.25 Mbits of embedded RAM reduces external memory dependency and simplifies board design.
  • High I/O density: 432 I/Os support extensive peripheral connectivity without external multiplexers.
  • Compact package: 1517‑FBGA (40×40) footprint helps conserve PCB area while supporting a high pin count.
  • Commercial temperature and RoHS compliance: Ready for mainstream electronic products with industry-standard environmental and material compliance.

Why Choose 5SGXMB6R3F40C4G?

The 5SGXMB6R3F40C4G combines very high logic capacity, substantial embedded memory, and a large I/O complement in a compact FBGA package, making it suitable for demanding commercial FPGA applications that require dense integration and on‑chip resources. As a member of the Stratix V GX family, it aligns with the family-level electrical and switching specifications documented for system designers.

Choose this device when you need a commercially graded Stratix V GX FPGA with significant programmable resources, a defined core voltage window, and a compact surface-mount package to support complex, high‑density designs.

Request a quote or submit a product inquiry to get pricing and availability for 5SGXMB6R3F40C4G.

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