5SGXMB6R2F43I3N

The 5SGXMB6R2F43I3N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1760-ball FCBGA package (42.5 × 42.5 mm). It provides a high-density, programmable fabric with integrated transceiver-capable architecture for demanding digital designs.

This industrial-grade device combines a large logic capacity and substantial embedded memory with a wide I/O complement and a low core-voltage operating range, making it suitable for applications that require high integration, high I/O counts, and operation across extended temperature ranges.

Key Features

• High Logic Capacity — Approximately 597,000 logic elements to support complex digital functions and large-scale designs.
• Embedded Memory — Approximately 53.248 Mbits of on-chip RAM for buffering, FIFOs, and block-memory requirements.
• I/O Density — Up to 600 user I/O pins for broad external interface and peripheral connectivity.
• Transceiver-capable Family — Stratix V GX devices are offered with transceiver speed grades in the family up to 14.1 Gbps, supporting high-speed serial link architectures (family-level characteristic reported in the device datasheet).
• Power and Core Supply — Core voltage supply specified between 820 mV and 880 mV, suitable for designs targeting this core-voltage envelope.
• Industrial Temperature Range — Rated for operation from –40 °C to 100 °C for deployment in temperature-challenging environments.
• Package and Mounting — 1760-ball BGA (FCBGA) surface-mount package, supplier package dimension 42.5 × 42.5 mm for compact board-level integration.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-speed serial interfaces — Use the device where large logic capacity and the Stratix V GX transceiver family characteristics support multi-gigabit serial links and protocol engines.
• Network and communications processing — Deploy for packet processing, protocol bridging, or other tasks requiring extensive logic and on-chip memory.
• High-density digital signal processing — Implement large-scale DSP pipelines, custom accelerators, and data-path-heavy functions using the abundant logic elements and embedded RAM.

Unique Advantages

• Substantial programmable capacity: Approximately 597,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Significant embedded memory: Approximately 53.248 Mbits of on-chip RAM lowers external memory dependence for buffering and local storage.
• Large I/O count: 600 I/Os allow flexible interfacing to peripherals, daughter cards, and high-pin-count connectors without resorting to multiplexing compromises.
• Industrial-grade thermal range: –40 °C to 100 °C operation supports deployment in industrial and temperature-stressed applications.
• Compact FCBGA footprint: 1760-FCBGA (42.5 × 42.5 mm) package offers high integration in a surface-mount form factor for dense PCB layouts.
• Compliance-ready: RoHS compliance simplifies environmental and regulatory acceptance in product development.

Why Choose 5SGXMB6R2F43I3N?

The 5SGXMB6R2F43I3N positions itself as a high-density, industrial-grade Stratix V GX FPGA option with a combination of large logic resources, substantial embedded RAM, and extensive I/O. Its specified core-voltage range and family transceiver characteristics make it appropriate for applications that require significant on-chip processing, high-speed serial capabilities, and reliable operation across extended temperature ranges.

This device is suited to engineering teams building high-performance, tightly integrated digital systems who require long-term stability, predictable thermal performance, and RoHS compliance. The packaging and I/O count support compact, connectivity-rich board designs while the embedded resources lower external component needs.

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