5SGXMB6R2F43I2N

The 5SGXMB6R2F43I2N is a Stratix V GX field programmable gate array (FPGA) from Intel, supplied in a 1760‑FCBGA package. It delivers a large programmable fabric with a high I/O count and significant on‑chip memory suitable for demanding industrial designs.

This device targets systems that require extensive logic capacity, large embedded memory, and flexible I/O in a surface‑mount FCBGA form factor, while operating across a broad industrial temperature range.

Key Features

• Logic Capacity  Approximately 597,000 logic elements, providing a substantial programmable fabric for complex digital designs.
• Embedded Memory  Approximately 53 Mbits of embedded memory (53,248,000 total RAM bits) to support large data buffers, on‑chip caching, and state storage.
• I/O Density  600 user I/Os to support wide parallel interfaces, multi‑lane connectivity, and extensive peripheral integration.
• Package and Mounting  1760‑BBGA (1760‑FCBGA) surface‑mount package with a supplier package footprint of 1760‑FCBGA (42.5 × 42.5 mm) for high‑density board integration.
• Power Domain  Core voltage supply range from 870 mV to 930 mV for defined operating conditions.
• Thermal and Environmental  Industrial temperature grade with an operating range of −40 °C to 100 °C and RoHS compliance for regulatory cleanliness.
• Family and Documentation  Part of the Stratix V GX family; the device references Stratix V electrical and switching characteristics, including transceiver and core speed grade information documented in the Stratix V device datasheet.

Typical Applications

• High‑performance communications  Use the Stratix V GX family device for designs that require large logic and I/O counts alongside documented transceiver grade information for high‑speed serial interfaces.
• Industrial control and automation  Industrial temperature rating (−40 °C to 100 °C) and a high pin count make this device suitable for robust control systems and machine automation.
• Data buffering and packet processing  Large embedded memory and abundant logic capacity support on‑chip buffering, protocol parsing, and pipeline implementations.

Unique Advantages

• Substantial programmable fabric  Nearly 597,000 logic elements enable implementation of complex algorithms and large‑scale custom logic without immediate external ASIC development.
• Large on‑chip memory  Approximately 53 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching requirements, simplifying BOM and board layout.
• High I/O count  600 I/Os provide flexibility for parallel buses, numerous peripherals, and multi‑lane interface requirements.
• Industrial reliability range  Specified operation from −40 °C to 100 °C supports deployment in harsher environments typical of industrial applications.
• Compact, manufacturable package  1760‑FCBGA (42.5 × 42.5 mm) surface‑mount package facilitates high‑density PCB designs while supporting standard assembly processes.
• Standards‑aligned supply and compliance  RoHS‑compliant device with defined core voltage range for predictable power planning.

Why Choose 5SGXMB6R2F43I2N?

The 5SGXMB6R2F43I2N balances high logic capacity, significant embedded memory, and a large I/O complement in a production‑ready industrial package. Its Stratix V GX family lineage and documented device electrical characteristics make it suitable for developers who need a robust FPGA platform with clear operating and power parameters.

This device is well suited to engineering teams building complex, high‑I/O systems that require on‑chip memory and reliable operation across extended temperature ranges, offering a scalable platform backed by Intel's Stratix V documentation and device support.

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