5SGXMB6R2F43C3N

The 5SGXMB6R2F43C3N is a commercial‑grade Stratix V GX field programmable gate array (FPGA) in a 1760‑FCBGA package. It integrates a high logic element count, substantial on‑chip RAM, and a large I/O complement to support complex digital designs.

This device is well suited for designs that require dense logic resources, significant embedded memory, and extensive I/O connectivity while operating from a low core supply voltage in commercial temperature environments.

Key Features

• Core Logic  Approximately 597,000 logic elements (cells) to implement large, multi‑function digital designs.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM for data buffering, FIFO, and local storage needs.
• I/O Capacity  Up to 600 I/Os to support wide parallel interfaces, high pin‑count peripherals, and dense board interconnects.
• Power and Voltage  Core supply specified between 820 mV and 880 mV to match low‑voltage FPGA power domains.
• Package and Mounting  1760‑BBGA (1760‑FCBGA) package with 42.5 × 42.5 mm dimensions; surface‑mount for high‑density PCB assembly.
• Temperature Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards and Compliance  RoHS compliant, meeting current environmental disposal and materials requirements.

Typical Applications

• High‑density digital processing  Use the device’s ~597k logic elements and ~53.25 Mbits of embedded RAM for complex signal processing, protocol stacks, and compute‑intensive logic.
• Wide I/O systems  Leverage up to 600 I/Os for multi‑lane interfaces, parallel data buses, and board‑level expansion.
• Memory‑intensive buffering  On‑chip RAM supports extensive buffering and FIFO implementations without immediate external memory dependence.

Unique Advantages

• High logic density: The large number of logic elements enables consolidation of multiple functions into a single FPGA, reducing system BOM and board complexity.
• Substantial embedded memory: Approximately 53.25 Mbits of on‑chip RAM reduces external memory bandwidth requirements and lowers latency for local data storage.
• Extensive I/O: 600 available I/Os provide flexible connectivity for dense peripheral and system interfaces.
• Low core voltage: 820–880 mV core supply aligns with modern low‑voltage power architectures for efficient power management.
• RoHS compliant package: Surface‑mount 1760‑FCBGA (42.5 × 42.5 mm) offering high‑density mounting while meeting environmental material standards.
• Commercial temperature operation: Rated for 0 °C to 85 °C to serve a wide range of commercial applications and environments.

Why Choose 5SGXMB6R2F43C3N?

The 5SGXMB6R2F43C3N combines a large logic fabric, substantial embedded RAM, and a high I/O count in a compact 1760‑FCBGA package, making it a practical option for designs that demand integration and dense functionality within a commercial temperature envelope. Its low core voltage and RoHS compliance align with modern system power and environmental requirements.

This device is suitable for engineering teams aiming to consolidate complex digital functions and memory‑heavy logic into a single FPGA, enabling cleaner board layouts and reduced external component count while leveraging Stratix V family documentation and specifications for design validation.

If you would like pricing or availability for 5SGXMB6R2F43C3N, request a quote or submit a procurement inquiry and our team will respond with next steps.