5SGXMB6R2F43C2LN

The 5SGXMB6R2F43C2LN is a Stratix® V GX field-programmable gate array (FPGA) IC designed for commercial-grade applications that require substantial programmable logic, embedded memory, and high I/O density. This device integrates 597,000 logic elements and approximately 53.25 Mbits of on-chip RAM to support complex digital designs and high-bandwidth system integration.

With 600 I/Os and a 1760-FCBGA (42.5×42.5 mm) package, the device targets system designs that demand large-scale logic resources, abundant memory, and extensive external connectivity while operating within a commercial temperature range of 0 °C to 85 °C.

Key Features

• High Logic Capacity  597,000 logic elements provide substantial programmable fabric for large, partitioned designs and complex state machines.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, FIFOs, and large data structures without external memory for many functions.
• Extensive I/O  600 general-purpose I/Os enable wide parallel interfaces, multi-channel connectivity, and dense board-level routing.
• Package and Mounting  1760-FCBGA (42.5×42.5 mm) package in a surface-mount ball-grid array for high-density board integration.
• Power Supply Range  Core supply specified from 820 mV to 880 mV to match system power rails and power-management designs.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications.
• RoHS Compliant  Device meets RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• High-performance digital processing  Use the large logic fabric and embedded RAM for compute-intensive signal processing pipelines and custom accelerators.
• Networking and communications  Leverage the high I/O count and on-chip memory for multi-channel packet processing, protocol bridging, and interface aggregation.
• Prototyping and system integration  The device’s logic density and I/O capacity make it suitable for consolidating multiple functions onto a single FPGA during prototype and early production phases.
• Embedded compute and control  Embedded memory and logic resources support complex control algorithms, state machines, and hardware-software co-designs.

Unique Advantages

• Large programmable fabric: 597,000 logic elements let you implement complex, parallelized logic without partitioning across multiple devices.
• Significant on-chip RAM: Approximately 53.25 Mbits of embedded memory reduces reliance on external DRAM for many buffering and caching needs.
• High I/O density: 600 available I/Os simplify board-level connectivity for multi-channel, multi-protocol systems.
• Commercial-grade operating window: Rated 0 °C to 85 °C for straightforward deployment in commercial environments.
• Compact FCBGA package: 1760-FCBGA (42.5×42.5 mm) enables dense PCB placement while maintaining a high pin count.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing workflows and environmental requirements.

Why Choose 5SGXMB6R2F43C2LN?

The 5SGXMB6R2F43C2LN combines a high logic element count, substantial embedded memory, and a large I/O complement in a single commercial-grade Stratix V GX FPGA package. It is positioned for designs that require consolidation of complex logic, on-chip data storage, and broad external connectivity while operating within typical commercial temperature ranges.

This device is well suited to engineering teams building high-density digital systems, communication modules, and advanced prototypes that benefit from integrated memory and extensive I/O. Its package and electrical specifications support compact board layouts and modern power-rail designs.

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