5SGXMB6R2F43C2G

The 5SGXMB6R2F43C2G is an Intel Stratix V GX field programmable gate array (FPGA) in a 1760-pin FCBGA package. It delivers large logic and memory resources combined with substantial I/O density for demanding commercial embedded designs.

With 597,000 logic elements, approximately 53.25 Mbits of embedded memory, and 600 user I/Os, this Stratix V GX device is positioned for high-density, I/O‑intensive applications that require significant on‑chip resources and a compact surface-mount package.

Key Features

• High logic density  597,000 logic elements to support complex digital designs and large-scale integration.
• Embedded memory  Approximately 53.25 Mbits of on-chip RAM to store large datasets and implement memory‑intensive functions.
• Extensive I/O  600 user I/Os to connect many peripherals, interfaces, and external devices without extensive external glue logic.
• Powering and core voltage  Specified core supply range from 870 mV to 930 mV to match system power-rail designs.
• Package and mounting  1760‑FBGA (1760‑FCBGA) surface-mount package supplied as 1760‑FCBGA (42.5 × 42.5 mm) for high-density PCB implementations.
• Commercial temperature grade  Rated for operation from 0 °C to 85 °C for commercial embedded applications.
• Standards compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Leverage 597,000 logic elements to implement large-scale custom logic and complex state machines on a single device.
• I/O‑intensive platforms  Use the device's 600 I/Os for multi‑interface gateways, front‑end control, and peripheral aggregation without extensive external components.
• Memory‑heavy designs  Deploy approximately 53.25 Mbits of embedded memory for buffering, LUT‑based storage and large on‑chip data structures.
• Commercial embedded products  Suitable for commercial-grade products requiring surface-mount integration in a 1760‑FCBGA package and operation across 0 °C to 85 °C.

Unique Advantages

• Massive on‑chip resources: 597,000 logic elements and ~53.25 Mbits of embedded memory reduce reliance on external logic and RAM, simplifying BOM and PCB complexity.
• High I/O capacity: 600 user I/Os enable broad peripheral connectivity and flexible interface allocation for complex system designs.
• Compact, production-ready package: 1760‑FCBGA (42.5 × 42.5 mm) surface-mount package provides a space-efficient footprint for dense PCB layouts.
• Low-voltage core operation: Core supply specified at 870 mV–930 mV supports optimized power delivery schemes for the FPGA core.
• Commercial temperature suitability: Rated 0 °C–85 °C, aligning with a wide range of commercial embedded applications.
• Regulatory compliance: RoHS compliance simplifies environmental and manufacturing compliance considerations.

Why Choose 5SGXMB6R2F43C2G?

This Stratix V GX FPGA balances very high logic capacity and embedded memory with substantial I/O capability in a compact 1760‑FCBGA package. It is well suited for designs that demand on‑chip resources to minimize external components while maintaining a commercial temperature operating window and low-voltage core characteristics.

Backed by Intel's Stratix V device documentation, the 5SGXMB6R2F43C2G provides verifiable specifications for engineers and procurement teams who require a high-density FPGA solution with clear electrical and package parameters.

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