5SGXMB6R2F40I3N

IC FPGA 432 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 53248000 597000 1517-FBGA (40x40)

Quantity 484 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-FBGA (40x40)Number of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs225400Number of Logic Elements/Cells597000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB6R2F40I3N – Stratix® V GX FPGA IC, 597,000 logic elements, ~53.25 Mbits RAM, 432 I/O

The 5SGXMB6R2F40I3N is a Stratix® V GX field-programmable gate array (FPGA) IC designed for high-density, industrial-grade digital systems. It delivers a large logic fabric and significant embedded memory in a compact 1517-FBGA (40×40) surface-mount package, making it suitable for designs that demand substantial on-chip resources and robust operating conditions.

As a member of the Stratix V GX family, the device supports the family-level transceiver and speed-grade offerings described in the Stratix V device datasheet and targets markets that require scalable logic capacity, high I/O counts, and extended temperature operation.

Key Features

  • High Logic Capacity — 597,000 logic elements (logic element cells) to implement complex digital functions, custom datapaths, and deep pipelined architectures.
  • Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support buffering, lookup tables, and state storage for data-intensive applications.
  • Rich I/O — 432 I/O pins to interface with high-pin-count peripherals, parallel buses, and extensive I/O mezzanine designs.
  • Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for use in industrial environments and systems requiring extended temperature ranges.
  • Power and Core Voltage — Core voltage supply specified from 820 mV to 880 mV to match Stratix V GX core power requirements.
  • Compact, High-Density Package — 1517-FBGA (40×40) surface-mount package for high-pin-count designs while minimizing board footprint.
  • RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.
  • Stratix V Family Capabilities — Part of the Stratix V GX family; refer to the device datasheet for available core and transceiver speed-grade options across the family.

Typical Applications

  • Telecommunications & Networking — Large logic capacity and abundant I/O enable packet processing, traffic management, and protocol bridging in network equipment.
  • High-Performance Signal Processing — Substantial on-chip RAM and logic resources suit video processing, DSP pipelines, and high-throughput data conditioning.
  • Industrial Control & Automation — Industrial temperature rating and high I/O count support real-time control, sensor aggregation, and motion-control systems.
  • Prototyping and Emulation — Dense logic fabric and memory make the device appropriate for hardware prototyping, algorithm validation, and FPGA-based emulation platforms.

Unique Advantages

  • Large-Scale Integration: 597,000 logic elements reduce external components by consolidating complex functions on-chip.
  • Embedded Memory for Throughput: Approximately 53.25 Mbits of RAM provides local storage for buffering and state machines, improving latency and determinism.
  • High I/O Count: 432 programmable I/Os enable direct interfacing to many peripherals and buses without extra glue logic.
  • Industrial Reliability: –40 °C to 100 °C operating range supports deployment in harsh or temperature-variable environments.
  • Space-Efficient Package: 1517-FBGA (40×40) offers a high pin density in a compact surface-mount form factor for board-area constrained designs.
  • Compliance Ready: RoHS compliance simplifies environmental and manufacturing requirements.

Why Choose 5SGXMB6R2F40I3N?

The 5SGXMB6R2F40I3N combines high logic density, significant embedded memory, and a large I/O count in a robust industrial-grade FPGA package. It is positioned for engineers and system designers who require on-chip capacity and flexibility to implement complex digital functions while meeting extended temperature and manufacturing compliance needs.

This Stratix V GX device is suitable for applications where on-board consolidation, scalable logic resources, and reliable operation across a wide temperature range deliver long-term value in performance-sensitive and industrial deployments.

Request a quote or submit a sales inquiry to obtain pricing, lead times, and availability for the 5SGXMB6R2F40I3N.

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