5SGXMB6R2F40I3N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 53248000 597000 1517-FBGA (40x40) |
|---|---|
| Quantity | 484 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-FBGA (40x40) | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 225400 | Number of Logic Elements/Cells | 597000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMB6R2F40I3N – Stratix® V GX FPGA IC, 597,000 logic elements, ~53.25 Mbits RAM, 432 I/O
The 5SGXMB6R2F40I3N is a Stratix® V GX field-programmable gate array (FPGA) IC designed for high-density, industrial-grade digital systems. It delivers a large logic fabric and significant embedded memory in a compact 1517-FBGA (40×40) surface-mount package, making it suitable for designs that demand substantial on-chip resources and robust operating conditions.
As a member of the Stratix V GX family, the device supports the family-level transceiver and speed-grade offerings described in the Stratix V device datasheet and targets markets that require scalable logic capacity, high I/O counts, and extended temperature operation.
Key Features
- High Logic Capacity — 597,000 logic elements (logic element cells) to implement complex digital functions, custom datapaths, and deep pipelined architectures.
- Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support buffering, lookup tables, and state storage for data-intensive applications.
- Rich I/O — 432 I/O pins to interface with high-pin-count peripherals, parallel buses, and extensive I/O mezzanine designs.
- Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for use in industrial environments and systems requiring extended temperature ranges.
- Power and Core Voltage — Core voltage supply specified from 820 mV to 880 mV to match Stratix V GX core power requirements.
- Compact, High-Density Package — 1517-FBGA (40×40) surface-mount package for high-pin-count designs while minimizing board footprint.
- RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.
- Stratix V Family Capabilities — Part of the Stratix V GX family; refer to the device datasheet for available core and transceiver speed-grade options across the family.
Typical Applications
- Telecommunications & Networking — Large logic capacity and abundant I/O enable packet processing, traffic management, and protocol bridging in network equipment.
- High-Performance Signal Processing — Substantial on-chip RAM and logic resources suit video processing, DSP pipelines, and high-throughput data conditioning.
- Industrial Control & Automation — Industrial temperature rating and high I/O count support real-time control, sensor aggregation, and motion-control systems.
- Prototyping and Emulation — Dense logic fabric and memory make the device appropriate for hardware prototyping, algorithm validation, and FPGA-based emulation platforms.
Unique Advantages
- Large-Scale Integration: 597,000 logic elements reduce external components by consolidating complex functions on-chip.
- Embedded Memory for Throughput: Approximately 53.25 Mbits of RAM provides local storage for buffering and state machines, improving latency and determinism.
- High I/O Count: 432 programmable I/Os enable direct interfacing to many peripherals and buses without extra glue logic.
- Industrial Reliability: –40 °C to 100 °C operating range supports deployment in harsh or temperature-variable environments.
- Space-Efficient Package: 1517-FBGA (40×40) offers a high pin density in a compact surface-mount form factor for board-area constrained designs.
- Compliance Ready: RoHS compliance simplifies environmental and manufacturing requirements.
Why Choose 5SGXMB6R2F40I3N?
The 5SGXMB6R2F40I3N combines high logic density, significant embedded memory, and a large I/O count in a robust industrial-grade FPGA package. It is positioned for engineers and system designers who require on-chip capacity and flexibility to implement complex digital functions while meeting extended temperature and manufacturing compliance needs.
This Stratix V GX device is suitable for applications where on-board consolidation, scalable logic resources, and reliable operation across a wide temperature range deliver long-term value in performance-sensitive and industrial deployments.
Request a quote or submit a sales inquiry to obtain pricing, lead times, and availability for the 5SGXMB6R2F40I3N.

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