5SGXMB6R2F40I3LG

The 5SGXMB6R2F40I3LG is a Stratix® V GX field-programmable gate array (FPGA) IC from Intel. This device combines a high logic element count with substantial on-chip memory and a large I/O complement in a compact 1517-FBGA (40x40) package.

Designed for industrial-grade applications, the device operates over an industrial temperature range and supports low-voltage core supply operation, delivering integration suited to designs that require large logic capacity, extensive I/O, and sizable embedded memory.

Key Features

• Core Logic  Provides 597,000 logic elements to support complex digital designs and large-scale integration.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM (Total RAM Bits: 53,248,000) for buffering, scratch storage, and on-chip data structures.
• I/O Capacity  432 general-purpose I/Os to handle high interface density and multiple parallel connections.
• Power  Core voltage supply range from 820 mV to 880 mV for the device core power domain.
• Package & Mounting  1517-FBGA (40x40) package in a surface-mount form factor for dense board-level integration.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40°C to 100°C.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control & Automation  Industrial temperature rating and broad I/O support enable deployment in factory automation, motion control, and machine-vision controllers.
• High‑density FPGA Designs  Large logic element count and on-chip RAM support complex logic integration for custom accelerators and system consolidation.
• System Integration & Prototyping  Generous I/O and memory resources simplify board-level integration and prototyping of multi-interface systems.
• Communications Equipment  High logic and I/O capacity make the device suitable for protocol processing, packet manipulation, and aggregation tasks in communications infrastructure equipment.

Unique Advantages

• High logic capacity: 597,000 logic elements allow large designs to be implemented in a single device, reducing the need for multiple FPGAs.
• Substantial on-chip memory: Approximately 53 Mbits of embedded RAM helps reduce external memory dependencies and simplifies board layout.
• Large I/O count: 432 I/Os accommodate dense board connectivity and multiple peripheral interfaces without additional glue logic.
• Industrial reliability: Rated for −40°C to 100°C operation to meet demanding environmental conditions.
• Compact BGA package: 1517-FBGA (40x40) surface-mount package enables high-density PCB designs while maintaining manageable assembly requirements.
• RoHS compliant: Aligns with common environmental and manufacturing standards for electronic components.

Why Choose 5SGXMB6R2F40I3LG?

The 5SGXMB6R2F40I3LG positions itself as a high-capacity, industrial-grade FPGA option for designs that need substantial programmable logic, abundant on-chip memory, and a high number of I/Os in a compact BGA package. Its operating voltage range and industrial temperature rating make it suitable for robust deployments where stability across conditions is required.

Engineers selecting this device benefit from the combination of integration density and environmental specification, making it a practical choice for system consolidation, complex signal processing, and high-density interface applications. For detailed electrical and switching characteristics, consult the manufacturer’s device documentation.

Request a quote or contact sales to discuss availability, pricing, and support for integrating the 5SGXMB6R2F40I3LG into your design.