5SGXMB6R2F43C1G

The 5SGXMB6R2F43C1G is a Stratix® V GX commercial-grade FPGA delivering very high logic density and on‑chip memory in a 1760‑FBGA package. It combines a large programmable fabric with abundant I/O and a low-voltage core to support complex, high‑integration designs in commercial applications.

Key on‑device resources include approximately 597,000 logic elements, approximately 53.25 Mbits of embedded memory, and 600 user I/O—packaged in a 1760‑FCBGA (42.5 × 42.5 mm) surface‑mount module with an operating range of 0 °C to 85 °C and a core supply of 870 mV to 930 mV.

Key Features

• Core Logic  Approximately 597,000 logic elements for dense, flexible implementation of custom digital functions.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM to support large buffering, lookup tables, and memory‑intensive processing.
• I/O Capacity  600 user I/O pins to enable broad interface support and high‑pin‑count system integration.
• Power and Voltage  Core voltage supply range of 870 mV to 930 mV for the device core power domain.
• Package and Mounting  1760‑FBGA, FCBGA package (1760‑FCBGA, 42.5 × 42.5 mm) in a surface‑mount form factor for high‑density board designs.
• Thermal/Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Compute Acceleration  Implement custom accelerators and bit‑parallel processing thanks to high logic element counts and on‑chip memory.
• Digital Signal Processing  Large embedded RAM and abundant logic make the device suitable for filtering, FFTs, and other DSP workloads.
• High‑Density I/O Systems  600 I/O pins support complex multi‑interface systems and high‑bandwidth peripheral integration.

Unique Advantages

• High Logic Density: Approximately 597,000 logic elements enable implementation of large, multi‑function designs on a single device.
• Substantial On‑Chip Memory: Approximately 53.25 Mbits of embedded RAM reduces external memory requirements and simplifies board design.
• Extensive I/O: 600 user I/O pins provide flexibility for interfacing to multiple peripherals and high‑pin‑count subsystems.
• Compact FCBGA Packaging: 1760‑FCBGA (42.5 × 42.5 mm) surface‑mount package balances high pin count with manageable board footprint.
• Commercial Temperature Range: Rated for 0 °C to 85 °C to meet standard commercial deployment environments.
• RoHS Compliance: Environmentally compliant for modern electronics manufacturing requirements.

Why Choose 5SGXMB6R2F43C1G?

The 5SGXMB6R2F43C1G delivers a combination of very high logic capacity, substantial embedded memory, and a large I/O complement in a single commercial‑grade Stratix® V GX FPGA package. These characteristics make it well suited to designs that require dense programmable logic, significant on‑chip buffering, and broad interface support while operating within commercial temperature limits.

Designers seeking a high‑density programmable platform for compute acceleration, signal processing, or complex I/O integration can leverage the 5SGXMB6R2F43C1G to consolidate functionality and reduce external components, backed by the Stratix V device family documentation.

If you would like pricing or availability, request a quote or submit a quote for the 5SGXMB6R2F43C1G.