5SGXMB6R2F40I3LN

The 5SGXMB6R2F40I3LN is a Stratix® V GX field programmable gate array (FPGA) in a 1517-FBGA (40×40) surface-mount package, manufactured by Intel. It delivers a very large logic and memory footprint combined with a high I/O count and industrial temperature operation, making it suitable for designs that require substantial on-chip resources and robust operating range.

As a Stratix V GX family device (series documentation provided), this device aligns with the Stratix V platform characteristics and is intended for applications needing high logic density, extensive embedded RAM, and flexible I/O connectivity within an industrial temperature window.

Key Features

• Logic Capacity — 597,000 logic elements, providing a high-density programmable fabric for complex digital functions and compute-intensive designs.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM (53,248,000 bits) to support large buffers, packet queues, and data-path storage without extensive external memory.
• I/O Density — 432 general-purpose I/O pins to enable broad interfacing options to peripherals, sensors, and high-pin-count boards.
• Package & Mounting — 1517-FBGA (40×40) package in a surface-mount form factor for compact board-level integration.
• Voltage Supply — Core supply range of 820 mV to 880 mV, suitable for designs that follow the device’s specified power infrastructure.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, supporting deployment in environments requiring extended temperature tolerance.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free manufacturing and assembly.
• Stratix V Family Transceiver Information (Series) — Stratix V GX family documentation lists GX channel transceiver speed grades, including channel rates up to 14.1 Gbps (series-level information from device documentation).

Typical Applications

• High-density compute and acceleration — Large logic element and embedded memory capacity support complex algorithms and hardware acceleration blocks inside a single device.
• High-throughput I/O and protocol bridging — High I/O count enables multi-channel interfacing and flexible board-level connectivity for protocol conversion and aggregation.
• Industrial control and ruggedized systems — Industrial temperature rating and robust package make the device suitable for control, imaging, and instrumentation in extended-temperature environments.

Unique Advantages

• High on-chip integration: 597,000 logic elements and approximately 53.25 Mbits of embedded RAM reduce dependence on external logic and memory, simplifying BOM and board complexity.
• Broad interfacing capability: 432 I/Os provide extensive connectivity options for multi-port systems and complex peripheral sets.
• Industrial-grade operation: −40 °C to 100 °C operating range supports deployments in demanding temperature environments.
• Compact, production-ready package: 1517-FBGA (40×40) surface-mount package supports dense PCB layouts and automated assembly flows.
• Documented Stratix V platform: Series documentation includes transceiver and electrical characteristics for Stratix V GX devices, enabling reference to family-level performance and implementation guidance.

Why Choose 5SGXMB6R2F40I3LN?

The 5SGXMB6R2F40I3LN provides a high-capacity Stratix V GX FPGA option for designs demanding substantial logic, large on-chip RAM, and a high number of I/Os within an industrial temperature envelope. Its combination of dense programmable resources and documented Stratix V family characteristics makes it well suited for engineers building compute-intensive, I/O-rich, or ruggedized systems.

Backed by Intel’s Stratix V device documentation, this device offers a clear specification set for power, temperature, and transceiver capabilities at the series level, supporting confident integration into long-life and high-performance designs.

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