5SGXMB6R2F40I3G

The 5SGXMB6R2F40I3G is a Stratix V GX Field Programmable Gate Array (FPGA) IC designed for industrial-grade digital designs. It combines a high logic-element count and substantial on-chip memory with a 1517-FBGA (40×40) surface-mount package to address complex system integration needs.

This device is suited for applications that require dense logic, abundant I/O, and robust operating range, delivering a platform for implementing large-scale digital signal processing, control logic, and high-throughput interfaces within industrial temperature environments.

Key Features

• High logic density — Approximately 597,000 logic elements to implement complex digital functions and large-scale designs.
• Embedded memory — Approximately 53.25 Mbits of on-chip RAM for data buffering, state storage, and memory-intensive algorithms.
• Significant I/O — 432 user I/O pins to support wide peripheral and interface connectivity.
• Core voltage — Core supply range of 820 mV to 880 mV to match system power design requirements.
• Industrial temperature grade — Rated for operation from –40 °C to 100 °C, suitable for harsh and industrial environments.
• Package and mounting — 1517‑FBGA (40×40) supplier device package with surface-mount mounting for compact board-level integration.
• Series-level transceiver capability — Part of the Stratix V GX family, which documents GX transceiver speed grades for high-speed serial channels at the device family level.

Typical Applications

• Industrial control and automation — Industrial temperature rating and large logic/memory resources enable complex control systems and real-time processing in factory and process environments.
• High-performance signal processing — High logic element count and substantial on-chip RAM support DSP algorithms, filtering, and data aggregation functions.
• Communications and networking — The Stratix V GX family includes high-speed transceiver capability at the series level, making the device suitable for high-throughput serial interfaces and protocol handling.
• Embedded system integration — Large I/O count and dense logic enable consolidation of multiple functions onto a single FPGA for compact system designs.

Unique Advantages

• Highly integrated logic and memory: Combines approximately 597,000 logic elements with ~53.25 Mbits of embedded RAM to reduce external memory dependence and simplify board design.
• Ample I/O for system connectivity: 432 I/O pins allow direct interfacing to a broad range of peripherals and high-pin-count subsystems.
• Industrial-ready thermal range: –40 °C to 100 °C rating supports deployment in demanding environments without derating logic capability.
• Compact board-level footprint: 1517‑FBGA (40×40) package enables dense PCB layouts while maintaining high pin count and routing flexibility.
• Controlled core power envelope: 820–880 mV supply range gives designers a defined operating window for power delivery and thermal planning.

Why Choose 5SGXMB6R2F40I3G?

The 5SGXMB6R2F40I3G positions itself as a high-capacity, industrial-grade FPGA option within the Stratix V GX family, offering a combination of large logic resources, substantial embedded RAM, and extensive I/O in a compact FBGA package. Its operating voltage and temperature specifications provide predictable behavior for robust system designs.

This device is well suited for engineering teams building complex digital systems that require consolidation of logic, memory, and interfaces—particularly in industrial and communications contexts where consistent temperature performance and high integration are essential. Selecting this part supports scalable design architectures that leverage the Stratix V GX device family.

Request a quote or submit your requirements today to evaluate 5SGXMB6R2F40I3G for your next design project.