5SGXMB6R2F40I2G

The 5SGXMB6R2F40I2G is a Stratix® V GX Field Programmable Gate Array (FPGA) offered in an industrial temperature grade. It integrates a high logic capacity and substantial on-chip memory to support complex, high-density digital designs.

This device provides a combination of large logic resources, approximately 53.25 Mbits of embedded memory, and 432 user I/O pins in a 1517‑FBGA (40×40) surface-mount package, with an operating range of –40 °C to 100 °C and a core voltage supply range of 870 mV to 930 mV.

Key Features

• Core Logic — 597,000 logic elements (cells) for large-scale combinational and sequential logic implementation.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage.
• I/O Density — 432 available I/O pins to interface with high-pin-count peripherals, mezzanine cards, and multi-lane I/O systems.
• Package & Mounting — 1517‑FBGA (40×40) package in a surface-mount form factor for board-level integration.
• Power & Supply — Core operating voltage specified from 870 mV to 930 mV to match power-rail design requirements.
• Temperature & Grade — Industrial temperature grade rating with an operating range of –40 °C to 100 °C for elevated-environment applications.
• Standards — RoHS compliant for use in assemblies requiring lead-free component sourcing.

Typical Applications

• High-density digital processing — Complex logic functions and custom datapath implementations that require hundreds of thousands of logic elements and large on-chip RAM.
• Multi-I/O systems — Designs needing large numbers of general-purpose I/Os for parallel interfaces, multi-channel aggregation, or board-level routing.
• Industrial and embedded platforms — Deployments that require industrial temperature operation (–40 °C to 100 °C) combined with significant logic and memory resources.

Unique Advantages

• High logic capacity: 597,000 logic elements enable integration of large or multiple subsystems into a single device, reducing external components.
• Substantial embedded memory: Approximately 53.25 Mbits of on-chip RAM supports large buffers, packet queues, and stateful algorithms without external memory.
• Large I/O count: 432 I/Os provide flexibility for complex board interfaces, direct sensor/pin access, and high-pin-count peripherals.
• Industrial temperature rating: –40 °C to 100 °C operation addresses robust deployments in harsher environments.
• Compact BGA package: 1517‑FBGA (40×40) surface-mount package balances thermal and routing considerations for high-density PCBs.
• Regulatory readiness: RoHS compliance assists in meeting lead-free assembly requirements.

Why Choose 5SGXMB6R2F40I2G?

The 5SGXMB6R2F40I2G positions itself where large logic capacity, significant embedded memory, and high I/O density are required in an industrial-grade FPGA. Its combination of 597,000 logic elements, approximately 53.25 Mbits of on-chip RAM, and 432 I/Os in a 1517‑FBGA (40×40) package makes it suitable for consolidating complex subsystems onto a single programmable device.

For engineering teams designing high-density digital systems that must operate across an extended temperature range and conform to RoHS standards, this Stratix V GX device provides a verifiable specification set for power, thermal, and I/O planning.

Request a quote for 5SGXMB6R2F40I2G or submit a procurement inquiry to receive pricing and availability information tailored to your project requirements.