5SGXMB6R2F40C2LN

The 5SGXMB6R2F40C2LN is an Intel Stratix V GX field programmable gate array (FPGA) delivered in a 1517‑FBGA (40×40) package. This device integrates a large logic fabric, substantial on‑chip RAM, and a high I/O count in a commercial‑grade surface‑mount package.

Designed for applications that require dense programmable logic, significant embedded memory, and numerous external interfaces, the device provides a compact integration point for complex digital designs while operating within a specified core voltage range and commercial temperature class.

Key Features

• Logic Capacity  597,000 logic elements for implementing large-scale combinational and sequential logic functions.
• Embedded Memory  Approximately 53 Mbits of on‑chip RAM to support buffers, FIFOs, and tightly coupled data storage.
• I/O Resources  432 user I/O pins to connect multiple peripherals, memory interfaces, and high‑pin‑count systems.
• Package & Mounting  1517‑FBGA (40×40) supplier device package; surface‑mount mounting type for compact PCB integration.
• Power Supply  Core voltage supply specified from 820 mV to 880 mV for designers to plan power delivery and sequencing.
• Operating Temperature  Commercial temperature grade: 0 °C to 85 °C for standard commercial deployments.
• RoHS Compliance  RoHS compliant to support regulatory and assembly requirements.

Typical Applications

• High‑density digital processing  Large FPGA fabric and embedded RAM make it suitable for designs that require substantial programmable logic and local memory.
• Complex I/O aggregation  With 432 I/Os, it fits systems that must interface to multiple peripherals, external memories, or multi‑lane front‑ends.
• Embedded compute and acceleration  On‑chip logic and memory support implementation of hardware accelerators, packet processing, or custom compute blocks.

Unique Advantages

• High logic density: 597,000 logic elements allow migration of large designs onto a single device, reducing board-level complexity.
• Significant on‑chip memory: Approximately 53 Mbits of embedded RAM reduces dependence on off‑chip memory for latency‑sensitive functions.
• Extensive I/O count: 432 I/Os simplify multi‑interface designs and minimize the need for external I/O expanders.
• Compact BGA package: 1517‑FBGA (40×40) delivers a dense footprint for space‑constrained PCBs while supporting surface‑mount assembly.
• Commercial temperature support: Rated 0 °C to 85 °C for standard commercial environments and applications.
• Regulatory readiness: RoHS compliance streamlines manufacturing and environmental requirements.

Why Choose 5SGXMB6R2F40C2LN?

The 5SGXMB6R2F40C2LN offers a balance of large programmable logic capacity, substantial embedded memory, and broad I/O resources in a compact 1517‑FBGA package. Its commercial temperature rating and defined core voltage range make it appropriate for advanced electronic systems that need dense integration without moving to industrial temperature grades.

This device is well suited to engineering teams targeting complex digital implementations, embedded acceleration, or multi‑interface aggregation who require verifiable specifications for logic, memory, I/O, package, and power when planning system architecture and BOMs.

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