5SGXMB6R2F40C2LG

The 5SGXMB6R2F40C2LG is an Intel Stratix® V GX field programmable gate array (FPGA) in a 1517-FBGA (40×40) package. It delivers high logic density and substantial on-chip RAM for designs that require extensive programmable logic, embedded memory, and a large number of I/O signals.

Configured as a commercial-grade device, this Stratix V GX FPGA is suitable for applications that need a combination of high logic element count, significant embedded memory capacity, and a compact surface-mount FBGA package.

Key Features

• Logic Capacity  597,000 logic elements (cells) provide a large programmable fabric for complex digital systems and high-density logic integration.
• Embedded Memory  Approximately 53.2 Mbits of total on-chip RAM (53,248,000 bits) supports buffering, FIFOs, and memory-intensive functions without external memory for many designs.
• I/O Resources  432 user I/Os enable broad peripheral connectivity and multi-channel interfacing in a single device.
• Power and Core Voltage  Core supply range of 820 mV to 880 mV allows designers to plan board power delivery and thermal budgets around the specified operating window.
• Package and Mounting  1517-FBGA (40×40) package with surface-mount mounting type offers a compact form factor for space-constrained PCBs.
• Temperature and Grade  Commercial grade, rated for an operating temperature range of 0 °C to 85 °C to match typical commercial electronics environments.
• Regulatory  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density FPGA systems  Ideal for designs requiring hundreds of thousands of logic elements and substantial on-chip RAM to implement complex finite-state machines, datapaths, and custom accelerators.
• Memory-intensive logic  Suited to buffering, packet processing, and other applications that benefit from approximately 53.2 Mbits of embedded memory.
• Multi-channel I/O designs  With 432 I/Os, useful for systems requiring wide parallel interfaces or multiple peripheral connections on a single device.

Unique Advantages

• High logic density: 597,000 logic elements enable consolidation of multi-chip designs into a single FPGA, reducing board complexity.
• Substantial on-chip memory: Approximately 53.2 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-holding tasks.
• Generous I/O count: 432 user I/Os provide flexibility for complex interfaces, board-level consolidation, and high channel counts.
• Compact FBGA package: The 1517-FBGA (40×40) surface-mount package balances high integration with a small PCB footprint.
• Commercial temperature rating: Rated 0 °C to 85 °C for deployment in standard commercial electronics environments.
• Defined core voltage range: 820 mV to 880 mV core supply specification simplifies power-system design and verification.

Why Choose 5SGXMB6R2F40C2LG?

The 5SGXMB6R2F40C2LG places a high-density Stratix V GX FPGA into a compact 1517-FBGA package, combining nearly 600k logic elements with over 50 Mbits of embedded RAM and a large I/O complement. This combination supports consolidation of complex digital functions and memory-heavy logic into a single, surface-mount device suitable for commercial applications.

Backed by Intel’s Stratix V device documentation and family-level technical resources, this part is appropriate for engineering teams seeking a high-capacity, commercially graded FPGA platform that supports scalable designs and predictable electrical requirements.

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