5SGXMB6R2F40C2N

The 5SGXMB6R2F40C2N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers very high logic density and significant on-chip memory capacity in a 1517‑FBGA (40×40) surface‑mount package for commercial‑grade designs.

This device is intended for applications that require large programmable logic resources, substantial embedded RAM, and a high count of I/O pins, while operating within the specified commercial temperature and core voltage ranges.

Key Features

• Core Logic 597,000 logic elements provide a high-capacity programmable fabric for complex digital designs.
• Embedded Memory Approximately 53.248 Mbits of on‑chip RAM to support large data buffers, lookup tables, and state storage.
• I/O Density 432 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting 1517‑FBGA (40×40) package in a surface‑mount form factor suitable for standard PCB assembly.
• Power Supply Specified core voltage range of 870 mV to 930 mV for proper device operation.
• Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance RoHS compliant.
• Family Transceiver Options (Series-Level) Stratix V GX family device documentation describes available transceiver speed grades (refer to the device datasheet for family-level transceiver specifications and speed-grade details).

Typical Applications

• High‑density digital designs — Large logic capacity and on‑chip RAM make this FPGA suitable for designs requiring substantial programmable resources.
• Multi‑interface systems — High I/O count supports parallel interfaces and multiple protocol endpoints.
• Prototype and system integration — Surface‑mount 1517‑FBGA packaging and commercial temperature rating fit board‑level integration for development and production systems.

Unique Advantages

• Extensive programmable logic: 597,000 logic elements enable implementation of complex finite state machines, datapaths, and custom accelerators without external logic.
• Substantial on‑chip memory: Approximately 53.248 Mbits of embedded RAM reduces dependence on external memory for buffering and lookup tables.
• High I/O capacity: 432 I/Os simplify integration with large sensor arrays, buses, and parallel interfaces.
• Commercial package and assembly: 1517‑FBGA (40×40) surface‑mount package supports standard PCB assembly flows.
• Clear operating envelope: Documented core voltage range (870 mV–930 mV) and 0 °C–85 °C commercial temperature rating facilitate power‑domain and thermal planning.
• RoHS compliant: Meets environmental compliance requirements for lead‑free assemblies.

Why Choose 5SGXMB6R2F40C2N?

The 5SGXMB6R2F40C2N positions itself as a high‑density Stratix V GX FPGA option for commercial designs that demand large programmable logic resources, significant embedded memory, and extensive I/O. Its documented operating and power parameters simplify system integration and supply‑chain planning.

This device is well suited to engineers and procurement teams building complex digital systems that require scalable logic capacity and on‑chip RAM while leveraging Intel’s Stratix V GX family documentation for transceiver and device‑level configuration options.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the 5SGXMB6R2F40C2N.