5SGXMB6R2F40C3N

The 5SGXMB6R2F40C3N is a Stratix V GX family FPGA offering high-density programmable logic and on-chip memory in a 1517‑FBGA (40×40) surface-mount package. With 597,000 logic elements, approximately 53 Mbits of embedded RAM and 432 I/O pins, this commercial‑grade device targets complex, high‑integration digital designs where logic capacity, memory, and I/O count are primary design drivers.

Designed as part of the Stratix V device family, the device follows the electrical and switching characteristic framework documented for Stratix V GX devices and is RoHS compliant.

Key Features

• High-density Logic 
  597,000 logic elements suitable for large-scale programmable logic implementations.
• On-chip Memory 
  Approximately 53 Mbits of embedded RAM to support large buffering, look-up tables, and state storage without external memory.
• Rich I/O Count 
  432 dedicated I/O pins to support wide parallel interfaces and dense connectivity to peripherals or daughtercards.
• Package & Mounting 
  1517‑FBGA (40×40) package in a surface-mount form factor for compact board-level integration.
• Core Voltage 
  Specified voltage supply range of 820 mV to 880 mV for the device core.
• Commercial Temperature Grade 
  Operating temperature range from 0 °C to 85 °C, targeted for commercial applications.
• Compliance 
  RoHS compliant.

Typical Applications

• High-density digital systems 
  Large logic capacity and substantial embedded RAM make this device well suited to complex logic consolidation and custom digital processing pipelines.
• Multi‑I/O interface hubs 
  The 432 I/Os support designs requiring broad parallel connectivity, protocol bridging, or multi‑lane external interfaces.
• Embedded memory‑heavy designs 
  Approximately 53 Mbits of on-chip RAM enables significant buffering and local data storage for packet processing, frame buffering, or algorithm staging.
• Commercial product development 
  Commercial temperature grading and surface-mount packaging align with mainstream electronic product BOMs and manufacturing flows.

Unique Advantages

• Scale of integration: The combination of 597,000 logic elements and substantial on‑chip RAM reduces reliance on external components and simplifies board-level architecture.
• High I/O density: 432 I/Os facilitate direct interfacing to multiple peripherals or wide parallel buses without extensive external multiplexing.
• Compact packaging: 1517‑FBGA (40×40) surface-mount package supports compact PCB layouts while maintaining high pin counts.
• Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for use in standard commercial electronic products.
• Defined core supply range: The 820 mV to 880 mV supply window provides clear electrical requirements for power delivery design.

Why Choose 5SGXMB6R2F40C3N?

The 5SGXMB6R2F40C3N positions itself where large programmable logic capacity, significant embedded memory, and high I/O count are required in commercial applications. As a Stratix V GX device, it aligns with the electrical and switching characteristic framework of the Stratix V family while providing a compact FBGA package for board-level integration.

Choose this FPGA for designs that demand logic density and on-chip memory consolidation to reduce external components, simplify PCB routing, and support complex digital and multi‑interface designs within a commercial temperature envelope.

Request a quote or submit an inquiry for availability and pricing to move your design forward with 5SGXMB6R2F40C3N.