5SGXMB6R2F40C3G

The 5SGXMB6R2F40C3G is a Stratix® V GX-series FPGA in a 1517-FBGA (40×40) surface-mount package. It delivers high-density programmable logic, substantial on-chip memory, and a large native I/O count in a commercial temperature grade for complex digital designs.

Targeted at commercial electronic systems, this device provides a combination of logic capacity, embedded RAM, and I/O flexibility for designs that require high integration within a compact BGA package.

Key Features

• Core logic density — 597,000 logic elements for implementing large-scale combinational and sequential logic networks.
• Logic block count — 225,400 logic blocks that support deep, finely partitioned designs and resource-intensive architectures.
• Embedded memory — approximately 53.2 Mbits of on-chip RAM (53,248,000 bits) to support buffering, packet storage, and local data processing.
• High I/O count — 432 user I/O pins for broad external connectivity and system interfacing.
• Power supply — core supply range of 820 mV to 880 mV, enabling predictable power planning for core regulators.
• Package and mounting — 1517-FBGA (40×40) surface-mount package for compact PCB integration.
• Operating temperature and grade — commercial grade with an operating range of 0 °C to 85 °C.
• Environmental compliance — RoHS compliant for global electronics manufacturing requirements.

Typical Applications

• High-density digital systems — suited for designs that require hundreds of thousands of logic elements and extensive on-chip memory for computation and control.
• Memory-intensive processing — embedded memory capacity supports buffering, packet queues, and local data storage for real-time processing tasks.
• Complex I/O interfacing — 432 I/Os allow connection to multiple peripherals, buses, and system interfaces within a single device.

Unique Advantages

• High logic capacity: 597,000 logic elements enable implementation of large-scale FPGA designs without immediate need for multi-device partitioning.
• Substantial embedded RAM: approximately 53.2 Mbits of on-chip memory reduces dependency on external memory for many buffering and scratchpad needs.
• Broad I/O availability: 432 I/Os simplify system integration by accommodating multiple interfaces and peripherals directly at the FPGA.
• Compact BGA package: 1517-FBGA (40×40) minimizes PCB footprint while providing the pin density required by feature-rich designs.
• Commercial temperature performance: rated for 0 °C to 85 °C to match standard commercial product environments.
• Regulatory readiness: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 5SGXMB6R2F40C3G?

This Stratix V GX FPGA combines high logic density, large embedded memory, and a generous I/O complement in a compact 1517-FBGA package, making it well suited for complex commercial designs that require extensive programmable resources. Its commercial temperature rating and RoHS compliance support deployment in mainstream electronics applications.

Designers seeking a scalable, high-capacity FPGA with clear power and thermal boundaries will find the 5SGXMB6R2F40C3G appropriate for advanced digital logic, memory-centric processing, and multi-interface system integration.

Request a quote or submit an inquiry today to evaluate 5SGXMB6R2F40C3G for your next commercial FPGA design.