5SGXMB6R1F43I2N

IC FPGA 600 I/O 1760FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 597000 1760-BBGA, FCBGA

Quantity 1,396 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs225400Number of Logic Elements/Cells597000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB6R1F43I2N – Stratix® V GX Field Programmable Gate Array (FPGA)

The 5SGXMB6R1F43I2N is a Stratix V GX series FPGA from Intel, offering a large programmable logic fabric combined with substantial on-chip memory and a high pin count. It is supplied in a 1760-FCBGA package and is graded for industrial temperature operation.

This device is intended for designs that require hundreds of thousands of logic elements, significant embedded RAM, and extensive I/O while operating from a low-voltage core supply and across an industrial temperature range.

Key Features

  • Logic Capacity — 597,000 logic elements provide large programmable logic resources for complex designs.
  • Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
  • I/O Density — 600 I/O pins to support wide peripheral interfacing and multi-channel connectivity.
  • Package & Mounting — 1760-FCBGA (42.5×42.5 mm) package, surface-mount mounting type for compact board integration.
  • Core Voltage — Low-voltage core operation with a supply range of 870 mV to 930 mV.
  • Temperature & Grade — Industrial grade with specified operating temperature from −40 °C to 100 °C.
  • Standards Compliance — RoHS compliant.

Typical Applications

  • Large-capacity programmable systems — Designs that require hundreds of thousands of logic elements and multi-Mbit embedded memory.
  • High-density I/O designs — Applications needing extensive external interfaces supported by 600 device I/Os.
  • Industrial embedded platforms — Systems that must operate across −40 °C to 100 °C and use surface-mount FCBGA packaging.
  • Low-voltage core designs — Architectures designed around a 0.87–0.93 V core supply.

Unique Advantages

  • Large programmable resource pool: 597,000 logic elements reduce the need for multiple devices for complex functions and integration.
  • Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM simplifies buffering and state storage inside the FPGA fabric.
  • High I/O scalability: 600 I/Os allow dense external connectivity and flexibility in system partitioning.
  • Industrial temperature rating: Rated from −40 °C to 100 °C for deployment in demanding environmental conditions.
  • Compact FCBGA package: 1760-FCBGA (42.5×42.5 mm) offers a space-efficient form factor for board-level integration.
  • Low-voltage core operation: 870 mV to 930 mV supply range supports modern low-power system architectures.

Why Choose 5SGXMB6R1F43I2N?

The 5SGXMB6R1F43I2N provides a substantial combination of logic, embedded memory, and I/O capacity in an industrial-grade Stratix V GX FPGA. Its specification set is suited to designs demanding large programmable resources, significant on-chip RAM, and extensive external interfacing while operating from a low-voltage core supply across a wide temperature range.

Selected for projects where integration density, on-chip memory and I/O count matter, this Intel Stratix V GX device is positioned to support complex FPGA-based implementations requiring reliable operation in industrial environments.

Request a quote for 5SGXMB6R1F43I2N to discuss availability and pricing for your design requirements.

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