5SGXMB6R2F40C1G

The 5SGXMB6R2F40C1G is a high-density Stratix V GX Field Programmable Gate Array (FPGA) in a 1517‑FBGA (40×40) package. It provides substantial on‑chip resources—approximately 597,000 logic elements and approximately 53.25 Mbits of embedded memory—paired with 432 I/Os, making it suitable for commercial temperature designs.

Designed for surface‑mount board integration, this FPGA targets applications that require large logic capacity, significant embedded memory, and a high I/O count within a compact BGA footprint. The device operates from a core supply range of 870 mV to 930 mV and is rated for commercial temperature operation (0 °C to 85 °C).

Key Features

• High Logic Capacity  Approximately 597,000 logic elements to implement large, complex digital designs.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM to support buffering, lookup tables, and memory‑intensive functions.
• Rich I/O Count  432 user I/Os for broad connectivity and board‑level interfacing flexibility.
• Package and Mounting  1517‑FBGA (40×40) package in a surface‑mount form factor for compact board layouts and high pin density.
• Power Envelope  Core supply range of 870 mV to 930 mV to match platform power architectures requiring low core voltage operation.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial electronic products.
• Regulatory  RoHS‑compliant material status for restricted‑substance requirements.

Typical Applications

• High‑density digital systems  Use the large logic resource and embedded RAM to implement complex, high‑gate‑count functions on a single device.
• Board‑level integration  Leverage 432 I/Os and the compact 1517‑FBGA package to consolidate multiple functions and reduce PCB routing complexity.
• Prototyping and evaluation  Deploy the device where substantial logic and memory headroom are required during design validation and development cycles.

Unique Advantages

• Substantial on‑chip memory: Embedded memory of approximately 53.25 Mbits reduces external memory dependence and simplifies system BOM.
• Large programmable logic: Approximately 597,000 logic elements enable integration of complex algorithms and wide datapaths within a single FPGA.
• High I/O density: 432 I/Os provide flexible interfacing for multi‑lane, multi‑bus, or mixed‑signal board architectures.
• Compact BGA package: 1517‑FBGA (40×40) balances high pin count with a small footprint for space‑constrained designs.
• Commercial temperature qualification: Rated 0 °C to 85 °C for deployment in typical commercial electronics environments.
• RoHS compliance: Meets restricted‑substance requirements for environmentally conscious manufacturing and supply chains.

Why Choose 5SGXMB6R2F40C1G?

The 5SGXMB6R2F40C1G positions as a high‑capacity Stratix V GX FPGA option for commercial designs that require extensive logic resources, significant embedded memory, and a large number of I/Os in a compact BGA package. Its combination of approximately 597,000 logic elements, roughly 53.25 Mbits of on‑chip RAM, and 432 I/Os supports consolidation of complex subsystems onto a single device, helping reduce board complexity and BOM count.

This device is appropriate for design teams seeking scalable logic and memory resources in a commercial temperature FPGA, with RoHS compliance and surface‑mount packaging for standard assembly processes.

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