5SGXMB6R2F43C2N

The 5SGXMB6R2F43C2N is a Stratix V GX family FPGA from Intel, engineered for high-density, programmable digital designs. It combines a large logic fabric, substantial embedded memory, and a high I/O count in a 1760-FCBGA package.

Designed for applications that require extensive logic resources and on-chip RAM, this commercial-grade device operates over a 0 °C to 85 °C range and supports the Stratix V GX device characteristics documented in the device datasheet, including published transceiver speed grades for the series.

Key Features

• Core Logic Density 597,000 logic elements and 225,400 logic array blocks (LABs) provide a large programmable fabric for complex designs.
• Embedded Memory Approximately 53.2 Mbits of on-chip RAM (total RAM bits: 53,248,000) to support deep buffering, large lookup tables, and state storage without relying solely on external memory.
• High I/O Count 600 device I/O pins enable dense peripheral and high-bandwidth interface integration.
• Power and Voltage Core supply range 870 mV to 930 mV (0.87–0.93 V) to match low-voltage system power domains.
• Package 1760-BBGA, FCBGA (supplier device package: 1760-FCBGA, 42.5 × 42.5 mm) for high-pin-count implementations in a single-chip solution.
• Operating Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory RoHS compliant.

Typical Applications

• Communications and Networking — Large logic density and family-level GX transceiver capabilities documented in the Stratix V datasheet make this device suitable for protocol offload, packet processing, and interface bridging.
• Data Center Acceleration — High logic element and embedded memory counts enable custom acceleration engines and compute offload modules.
• High‑Performance Video and Imaging — Extensive on-chip RAM and abundant logic support parallel pipelines, real-time processing, and multi-channel video interfaces.
• Prototyping and Complex SoC Integration — Dense programmable fabric and 600 I/O simplify integration of multiple subsystems for system validation and prototype platforms.

Unique Advantages

• High integration in a single device: 597,000 logic elements and ~53.2 Mbits of embedded memory reduce the need for external components and simplify board-level design.
• Large I/O footprint: 600 I/Os enable direct connection to a wide set of peripherals, transceivers, and daughter-card interfaces.
• Compact high-pin-count package: 1760-FCBGA (42.5 × 42.5 mm) delivers high connectivity in a compact form factor.
• Low-voltage core operation: 0.87–0.93 V supply range aligns with modern power architectures for efficient system integration.
• Commercial grade with environmental compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial applications.
• Documented family-level electrical and transceiver characteristics: Stratix V device datasheet provides detailed electrical, switching, and transceiver specifications for design planning.

Why Choose 5SGXMB6R2F43C2N?

The 5SGXMB6R2F43C2N positions itself as a high-density Stratix V GX FPGA offering a combination of large logic capacity, substantial embedded memory, and extensive I/O in a single 1760-FCBGA package. It is well suited for commercial designs that demand on-chip resources to minimize external parts and streamline system architecture.

For engineering teams building complex digital subsystems—ranging from networking and acceleration to high-throughput video processing—this device provides a documented hardware foundation and the on-chip resources needed to scale logic, memory, and interfaces within a single programmable device.

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