5SGXMB6R2F43C3G

The 5SGXMB6R2F43C3G is an Intel Stratix V GX field-programmable gate array (FPGA) in a 1760-FCBGA package. It provides a high-density programmable fabric with substantial embedded memory and a large number of I/O pins for complex digital designs.

Designed for commercial-grade applications, this device combines a large logic element count, significant on-chip RAM, and a wide supply voltage window to support advanced designs that require extensive logic, memory resources, and board-level connectivity.

Key Features

• Large programmable fabric — 597,000 logic elements to implement complex digital logic, state machines, and custom accelerators.
• Significant embedded memory — Total on-chip RAM of 53,248,000 bits (approximately 53.2 Mbits) for buffering, FIFOs, and on-chip data storage.
• High I/O count — 600 I/O pins to support wide data buses, parallel interfaces, and dense board connectivity.
• Logic block density — 225,400 logic blocks to partition and organize large designs across the fabric.
• Package and mounting — 1760-FCBGA (42.5 × 42.5 mm) surface-mount package for high pin-count, board-level integration.
• Core supply range — Core voltage supply range of 820 mV to 880 mV to match target power domains.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C for commercial-environment deployments.
• Environmental compliance — RoHS compliant.
• Series-level transceiver capability — As part of the Stratix V GX family, the series supports high-speed transceiver operation (series specification lists GX channel data rates up to 14.1 Gbps), enabling high-speed serial interfaces when configured per series guidelines.

Typical Applications

• High-density digital processing — Implement large-scale RTL, parallel datapaths, and custom accelerators using the device’s extensive logic element and block resources.
• Memory-intensive buffering and packet processing — Leverage approximately 53.2 Mbits of embedded RAM for buffering, FIFOs, and on-chip data storage.
• High-pin-count system interfaces — Use the 600 I/Os and FCBGA package to connect wide parallel buses, multiple peripherals, and board-level interfaces.
• High-speed serial links (series capability) — Apply Stratix V GX series transceiver capabilities for high-speed serial communications in designs that require series-specified transceiver operation.

Unique Advantages

• Highly integrated programmable fabric: 597,000 logic elements and 225,400 logic blocks provide capacity for large-scale, system-level integration on a single device.
• Substantial on-chip memory: Approximately 53.2 Mbits of embedded RAM reduces external memory dependence and simplifies board designs that need local data storage.
• Extensive board connectivity: 600 I/Os in a 1760-FCBGA package enable dense peripheral connectivity and flexible interface routing.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation to meet commercial-environment deployment requirements.
• Controlled core power domain: Core supply defined between 820 mV and 880 mV to align with low-voltage power architectures.
• Regulatory friendliness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXMB6R2F43C3G?

The 5SGXMB6R2F43C3G positions itself as a high-density, high-capacity Stratix V GX FPGA for commercial applications that need substantial logic resources, ample embedded RAM, and a large I/O complement in a single-package solution. Its combination of nearly 600k logic elements, approximately 53.2 Mbits of on-chip memory, and 600 I/Os makes it suitable for designs that consolidate multiple subsystems into one programmable device.

Engineers and procurement teams seeking a device backed by Intel’s Stratix V GX series can leverage the device’s series-level transceiver capabilities and the available package options to build scalable designs while maintaining manufacturing and environmental compliance.

If you would like pricing, availability, or a formal quote for the 5SGXMB6R2F43C3G, submit a request for a quote or product inquiry and our team will respond with the next steps to support your procurement and design evaluation.