5SGXMB6R2F43I3G

The 5SGXMB6R2F43I3G is an Intel Stratix® V GX series FPGA offering very high logic density and large embedded memory for industrial applications. As a high-capacity, surface-mount FPGA in a 1760-FCBGA package, it is suited to designs that require extensive on-chip logic, broad I/O connectivity, and industrial temperature operation.

Key Features

• High Logic Density — Provides 597,000 logic elements to implement complex programmable logic and custom digital functions.
• Substantial Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for buffering, packet processing, or large lookup tables.
• Extensive I/O — Up to 600 user I/O pins to support wide parallel interfaces, multiple high-speed links, and diverse peripheral connections.
• Industrial Temperature Grade — Rated for operation from −40°C to 100°C, enabling deployment in demanding environmental conditions.
• Optimized Core Supply — Core voltage supply range of 820 mV to 880 mV to match platform power-rail requirements.
• Robust Package — 1760-FCBGA (1760-BBGA) package, supplier device package 1760-FCBGA (42.5 × 42.5 mm), suitable for high-density board designs and surface-mount assembly.
• Regulatory Compliance — RoHS-compliant construction for use in regulated supply chains.

Typical Applications

• Industrial Systems — High logic capacity and industrial temperature rating make this device suitable for factory automation, motor control controllers, and rugged embedded controllers.
• High-density Networking and Communications — Large embedded memory and extensive I/O support packet buffering, parallel data paths, and multi‑channel interfaces; Stratix V GX family transceiver speed grades are available across the family for high-speed links.
• Signal Processing and Acceleration — The combination of many logic elements and substantial on-chip RAM supports custom DSP pipelines, protocol offload, and hardware acceleration tasks.

Unique Advantages

• Significant on-chip resources: 597,000 logic elements and approximately 53.25 Mbits of embedded memory reduce the need for external logic and RAM, simplifying board-level design.
• Large I/O footprint: 600 I/O pins enable broad peripheral connectivity and support for parallel interfaces and multiple simultaneous channels.
• Industrial-ready thermal range: −40°C to 100°C operation broadens deployment options for harsh and temperature-variable environments.
• Compact, manufacturable package: 1760-FCBGA surface-mount package (42.5 × 42.5 mm) delivers high pin count in a form factor compatible with modern PCB assembly.
• Controlled core voltage: Defined supply range (0.82–0.88 V) helps designers plan power delivery and thermal management precisely.
• Standards-aligned supply chain: RoHS compliance supports regulated product builds and environmental requirements.

Why Choose 5SGXMB6R2F43I3G?

The 5SGXMB6R2F43I3G balances very high logic capacity and substantial embedded memory with a wide I/O complement and industrial-grade thermal tolerance, making it a capable choice for complex, reliability-focused designs. Its 1760-FCBGA surface-mount package and defined core supply range allow predictable integration into high-performance boards where on-chip resources and I/O density reduce external component count.

This Intel Stratix V GX device is positioned for engineering teams building industrial controllers, networking and communication equipment, and hardware-accelerated signal-processing systems that require scalable logic resources paired with robust operating conditions and compliance with RoHS requirements.

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