5SGXMB6R3F40I3N

The 5SGXMB6R3F40I3N is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) in a 1517‑FBGA (40×40) surface‑mount package. This industrial‑grade device combines high logic density, abundant embedded memory, and broad I/O capacity for compute‑intensive and high‑rate I/O designs.

Engineered for applications that require large programmable logic resources and industrial temperature operation, the device provides deterministic operating ranges and documented electrical characteristics as part of the Stratix V family.

Key Features

• High logic density  597,000 logic elements to implement complex digital functions and deep datapaths.
• Substantial on‑chip memory  Approximately 53.25 Mbits of embedded memory for buffering, packet processing, and state storage.
• Extensive I/O count  432 user I/Os to support wide parallel buses, multi‑lane interfaces, and dense connectivity.
• GX transceiver family support  Part of the Stratix V GX device line—series documentation includes GX transceiver speed grades (series support up to 14.1 Gbps depending on speed grade).
• Industrial operating range  Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• Core supply voltage  Core operating range of 820 mV to 880 mV as specified for device power rails.
• Package and mounting  1517‑FBGA (40×40) surface‑mount package for compact board integration and high pin count routing.
• RoHS compliant  Conforms to RoHS requirements for lead‑free assembly processes.

Typical Applications

• High‑rate data communications  Leverages Stratix V GX transceiver capabilities and large logic/memory resources for packet processing and line‑rate interfacing.
• Signal processing and acceleration  High logic element count and abundant embedded RAM enable DSP, filtering, and custom accelerator designs.
• Industrial control and automation  Industrial temperature rating and robust I/O count support rugged control systems, machine vision front‑ends, and factory automation.

Unique Advantages

• High programmable density: 597,000 logic elements provide headroom for complex state machines, wide datapaths, and parallel processing implementations.
• Large on‑chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• Wide I/O flexibility: 432 I/Os allow support for multiple interfaces and high‑pin‑count peripherals without external multiplexing.
• Industrial robustness: Rated for −40 °C to 100 °C operation, suitable for demanding environmental deployments.
• Compact, high‑pin package: 1517‑FBGA (40×40) provides a dense footprint for board space‑constrained systems while maintaining routing capability.
• Standards‑backed family documentation: Integration within the Stratix V GX device family provides access to documented electrical and transceiver specifications.

Why Choose 5SGXMB6R3F40I3N?

The 5SGXMB6R3F40I3N is positioned for designs that demand a combination of high logic capacity, significant on‑chip memory, and extensive I/O in an industrial‑rated FPGA. Its Stratix V GX lineage and documented device characteristics make it suitable for developers who need deterministic operating parameters and support for high‑rate transceiver applications.

Choose this device when your project requires large programmable resources in a compact 1517‑FBGA package, the ability to operate across an industrial temperature range, and alignment with Stratix V family documentation for design and validation.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical details for the 5SGXMB6R3F40I3N.