5SGXMB6R3F40I4N

IC FPGA 432 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 53248000 597000 1517-FBGA (40x40)

Quantity 1,947 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-FBGA (40x40)Number of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs225400Number of Logic Elements/Cells597000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB6R3F40I4N – Stratix® V GX FPGA, 597,000 Logic Elements

The 5SGXMB6R3F40I4N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offering very large programmable logic capacity and substantial on‑chip memory. Designed for designs that require dense logic, wide I/O, and industrial operating conditions, this device provides a platform for complex digital processing and system integration.

This device is characterized by a high logic element count, extensive embedded RAM, and a 1517‑FBGA (40×40) surface‑mount package, making it appropriate for applications demanding heavy logic integration and robust thermal performance.

Key Features

  • Logic Capacity — 597,000 logic elements, enabling large-scale integration of complex logic, custom datapaths, and parallel processing engines.
  • Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM, suitable for buffering, lookup tables, and state storage in memory‑intensive designs.
  • I/O Density — 432 user I/Os to support broad peripheral connectivity and high‑pin‑count interfacing.
  • Power and Core Supply — Core voltage supply specified between 820 mV and 880 mV, matching low‑voltage FPGA core requirements.
  • Package & Mounting — 1517‑FBGA (40×40) supplier device package in a surface‑mount form factor for compact board integration.
  • Operating Range & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
  • Compliance — RoHS‑compliant, aligning with common environmental and manufacturing requirements.
  • Series Transceiver Capability (Series Level) — Stratix V GX family documentation describes transceiver speed grades with channels up to 14.1 Gbps, indicating series‑level support for high‑speed serial interfaces.

Typical Applications

  • High‑density digital processing — Implement large custom logic blocks, parallel accelerators, and complex finite state machines using hundreds of thousands of logic elements.
  • Memory‑intensive designs — Leverage approximately 53.25 Mbits of embedded RAM for buffering, packet handling, or on‑chip data structures.
  • High‑pin-count systems — Utilize 432 I/Os to connect to multiple peripherals, mezzanine modules, or board‑level subsystems.
  • Industrial and rugged applications — Industrial temperature rating (−40 °C to 100 °C) supports deployment in harsh or wide‑temperature environments.
  • High‑speed communications (series‑level) — Stratix V GX series transceiver speed grades support high‑throughput serial links for networking and telecom system designs.

Unique Advantages

  • Massive programmable logic — 597,000 logic elements reduce the need for multi‑chip partitioning and simplify complex SoC implementations.
  • Significant on‑chip RAM — Approximately 53.25 Mbits of embedded memory helps minimize external memory dependency and improves latency for local data processing.
  • Extensive I/O support — 432 I/Os enable versatile interfacing with sensors, transceivers, and peripheral ICs without immediate need for I/O expansion.
  • Industrial temperature capability — Operates from −40 °C to 100 °C, supporting long‑life deployments in industrial and outdoor equipment.
  • Compact FBGA package — 1517‑FBGA (40×40) surface‑mount package balances board area efficiency with high pin count for dense system designs.
  • Low‑voltage core operation — Core supply between 820 mV and 880 mV aligns with modern low‑voltage power architectures to help optimize power delivery networks.

Why Choose 5SGXMB6R3F40I4N?

The 5SGXMB6R3F40I4N provides a high‑capacity Stratix V GX FPGA platform that combines nearly 600k logic elements, substantial embedded RAM, and extensive I/O in a compact FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for long‑life, rugged applications where integration density and on‑chip memory are critical.

This FPGA is positioned for engineers and system designers who require scalable logic resources, ample on‑chip memory, and robust I/O capability in a surface‑mount package, enabling consolidation of complex digital functions and reducing system bill‑of‑materials.

Request a quote or submit a purchase inquiry to evaluate how the 5SGXMB6R3F40I4N can meet the requirements of your next high‑density FPGA design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up