5SGXMB6R3F40I4N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 53248000 597000 1517-FBGA (40x40) |
|---|---|
| Quantity | 1,947 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-FBGA (40x40) | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 225400 | Number of Logic Elements/Cells | 597000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMB6R3F40I4N – Stratix® V GX FPGA, 597,000 Logic Elements
The 5SGXMB6R3F40I4N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offering very large programmable logic capacity and substantial on‑chip memory. Designed for designs that require dense logic, wide I/O, and industrial operating conditions, this device provides a platform for complex digital processing and system integration.
This device is characterized by a high logic element count, extensive embedded RAM, and a 1517‑FBGA (40×40) surface‑mount package, making it appropriate for applications demanding heavy logic integration and robust thermal performance.
Key Features
- Logic Capacity — 597,000 logic elements, enabling large-scale integration of complex logic, custom datapaths, and parallel processing engines.
- Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM, suitable for buffering, lookup tables, and state storage in memory‑intensive designs.
- I/O Density — 432 user I/Os to support broad peripheral connectivity and high‑pin‑count interfacing.
- Power and Core Supply — Core voltage supply specified between 820 mV and 880 mV, matching low‑voltage FPGA core requirements.
- Package & Mounting — 1517‑FBGA (40×40) supplier device package in a surface‑mount form factor for compact board integration.
- Operating Range & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Compliance — RoHS‑compliant, aligning with common environmental and manufacturing requirements.
- Series Transceiver Capability (Series Level) — Stratix V GX family documentation describes transceiver speed grades with channels up to 14.1 Gbps, indicating series‑level support for high‑speed serial interfaces.
Typical Applications
- High‑density digital processing — Implement large custom logic blocks, parallel accelerators, and complex finite state machines using hundreds of thousands of logic elements.
- Memory‑intensive designs — Leverage approximately 53.25 Mbits of embedded RAM for buffering, packet handling, or on‑chip data structures.
- High‑pin-count systems — Utilize 432 I/Os to connect to multiple peripherals, mezzanine modules, or board‑level subsystems.
- Industrial and rugged applications — Industrial temperature rating (−40 °C to 100 °C) supports deployment in harsh or wide‑temperature environments.
- High‑speed communications (series‑level) — Stratix V GX series transceiver speed grades support high‑throughput serial links for networking and telecom system designs.
Unique Advantages
- Massive programmable logic — 597,000 logic elements reduce the need for multi‑chip partitioning and simplify complex SoC implementations.
- Significant on‑chip RAM — Approximately 53.25 Mbits of embedded memory helps minimize external memory dependency and improves latency for local data processing.
- Extensive I/O support — 432 I/Os enable versatile interfacing with sensors, transceivers, and peripheral ICs without immediate need for I/O expansion.
- Industrial temperature capability — Operates from −40 °C to 100 °C, supporting long‑life deployments in industrial and outdoor equipment.
- Compact FBGA package — 1517‑FBGA (40×40) surface‑mount package balances board area efficiency with high pin count for dense system designs.
- Low‑voltage core operation — Core supply between 820 mV and 880 mV aligns with modern low‑voltage power architectures to help optimize power delivery networks.
Why Choose 5SGXMB6R3F40I4N?
The 5SGXMB6R3F40I4N provides a high‑capacity Stratix V GX FPGA platform that combines nearly 600k logic elements, substantial embedded RAM, and extensive I/O in a compact FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for long‑life, rugged applications where integration density and on‑chip memory are critical.
This FPGA is positioned for engineers and system designers who require scalable logic resources, ample on‑chip memory, and robust I/O capability in a surface‑mount package, enabling consolidation of complex digital functions and reducing system bill‑of‑materials.
Request a quote or submit a purchase inquiry to evaluate how the 5SGXMB6R3F40I4N can meet the requirements of your next high‑density FPGA design.

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