5SGXMB6R3F43C2LN

The 5SGXMB6R3F43C2LN is a Stratix V GX field programmable gate array supplied in a 1760-FCBGA (42.5×42.5 mm) surface-mount package. It delivers a high-density programmable logic fabric with 597,000 logic elements and approximately 53.2 Mbits of embedded memory for integration of complex digital functions.

Designed for commercial-temperature applications, this device provides 600 I/O pins and operates from a core supply voltage between 820 mV and 880 mV, with an ambient operating range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Logic Capacity  High-density programmable fabric with 597,000 logic elements for complex logic integration and custom hardware acceleration.
• Embedded Memory  Approximately 53.2 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive functions.
• I/O Resources  600 general-purpose I/O pins to support high-pin-count interfacing and multi-channel connectivity.
• Package & Mounting  1760-FCBGA package (42.5×42.5 mm), surface-mount mounting type suitable for high-density board designs.
• Power Supply  Core voltage range of 820 mV to 880 mV to match platform power architectures and dynamic power management strategies.
• Temperature Grade  Commercial operating range from 0 °C to 85 °C for standard embedded and commercial electronic systems.
• Compliance  RoHS compliant to meet common environmental and regulatory requirements.

Typical Applications

• High-density logic integration: Use the large logic-element count to consolidate complex custom digital logic onto a single device and reduce system BOM.
• On-chip buffering and memory functions: Leverage approximately 53.2 Mbits of embedded RAM for packet buffering, frame storage, or intermediate data staging within the FPGA.
• High-pin-count I/O designs: The 600 I/O pins support designs that require extensive external interfacing, multi-channel sensors, or parallel data lanes.

Unique Advantages

• High integration density: 597,000 logic elements and substantial embedded memory enable consolidation of multiple functions into a single FPGA, simplifying board design.
• Flexible I/O capacity: 600 I/Os accommodate complex connectivity requirements without immediate need for external I/O expanders.
• Compact, manufacturable package: 1760-FCBGA (42.5×42.5 mm) surface-mount package supports high-density PCB layouts while maintaining manufacturability.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for typical commercial embedded systems.
• Regulatory readiness: RoHS compliance supports adherence to common environmental standards in product development.

Why Choose 5SGXMB6R3F43C2LN?

The 5SGXMB6R3F43C2LN positions itself as a high-density, commercially-rated Stratix V GX FPGA suitable for designs that require extensive logic resources, substantial on-chip memory, and broad I/O capability in a single-package solution. Its combination of 597,000 logic elements, approximately 53.2 Mbits of embedded RAM, and 600 I/Os makes it a practical choice for consolidating complex processing, buffering, and interfacing tasks.

This device is well suited to engineering teams and procurement organizations targeting advanced commercial embedded systems where integration density, I/O scalability, and compliance with RoHS are required. Its package and supply-voltage specifications help align with established board designs and power architectures.

Request a quote or submit a purchase inquiry to evaluate the 5SGXMB6R3F43C2LN for your next design project.