5SGXMB6R3F43C2N

The 5SGXMB6R3F43C2N is an Intel Stratix® V GX field-programmable gate array supplied in a 1760-FCBGA package (42.5×42.5 mm). It provides a high-capacity programmable-logic resource with on-chip RAM and a large I/O count for dense, I/O-rich designs.

This device is specified for commercial temperature operation (0 °C to 85 °C) and RoHS-compliant manufacturing, and its electrical and switching characteristics are documented in the Stratix V device datasheet, which covers operating conditions, power, and I/O timing.

Key Features

• High Logic Capacity — 597,000 logic elements to implement large-scale programmable logic and complex functions.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for buffering, frame storage, and memory-intensive logic.
• Rich I/O — 600 user I/O pins to support extensive peripheral and board-level interfacing.
• Stratix V GX Family — Part of the Stratix V GX series; datasheet includes electrical and switching characteristics and transceiver-related information for the family.
• Compact BGA Package — 1760-BBGA / 1760-FCBGA mounting for a dense board footprint (package dimension 42.5×42.5 mm).
• Power and Supply — Core voltage supply range of 870 mV to 930 mV for device operation.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation suitable for standard commercial environments.
• Surface Mount — Surface-mount device designed for modern PCB assembly processes.
• Environmental — RoHS compliant.

Typical Applications

• I/O-Intensive Systems — Use the device’s 600 I/O pins to connect numerous external peripherals, interfaces, and subsystems.
• Large-Scale Programmable Logic — Leverage 597,000 logic elements to implement complex digital designs and custom processing pipelines.
• Memory-Dependent Designs — Utilize approximately 53.25 Mbits of embedded memory for frame buffers, FIFOs, and data storage close to logic.

Unique Advantages

• High integration density: Large logic element count and substantial embedded RAM reduce the need for external logic and memory components.
• Extensive board connectivity: 600 I/O pins enable broad interfacing and flexible pin assignment for complex PCBs.
• Compact system footprint: 1760-FCBGA package (42.5×42.5 mm) delivers high I/O and logic density in a single surface-mount package.
• Precision supply range: Defined core voltage window (870 mV–930 mV) supports controlled power delivery and design planning.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
• Documented device characteristics: Electrical and switching characteristics for the Stratix V family are available in the device datasheet for design verification.

Why Choose 5SGXMB6R3F43C2N?

The 5SGXMB6R3F43C2N offers substantial programmable logic resources, significant on-chip memory, and a high I/O count in a compact 1760-FCBGA package—making it suitable where integration density and board-level connectivity are priorities. Its commercial temperature rating and documented electrical/switching characteristics provide designers with clear operating parameters for system planning.

This device is positioned for designs that require large logic capacity and embedded memory within a single FPGA package, backed by Intel’s Stratix V family documentation for electrical and timing reference.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical support for the 5SGXMB6R3F43C2N. Our team can provide lead-time details and help evaluate the device for your project requirements.