5SGXMB6R3F43C3G

IC FPGA 600 I/O 1760FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 597000 1760-BBGA, FCBGA

Quantity 1,254 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs225400Number of Logic Elements/Cells597000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB6R3F43C3G – Stratix® V GX FPGA, 1760-FCBGA

The 5SGXMB6R3F43C3G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel in a 1760-BBGA FCBGA package. It is a commercial-grade FPGA offering a large programmable fabric, substantial embedded memory, and a high I/O count for complex, high-density digital designs.

Key device parameters include approximately 597,000 logic elements, roughly 53.25 Mbits of on-chip RAM, up to 600 user I/Os, and a specified core supply range of 820 mV to 880 mV. The device is specified for commercial operating temperatures from 0 °C to 85 °C and is RoHS compliant.

Key Features

  • Programmable Fabric Approximately 597,000 logic elements to implement large-scale logic, custom datapaths, and complex control logic.
  • Embedded Memory Approximately 53.25 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
  • I/O Capacity Up to 600 user I/Os to support extensive peripheral connectivity, parallel interfaces, and multi-channel I/O designs.
  • Power and Core Supply Core voltage supply specified from 820 mV to 880 mV for the device core.
  • Package and Mounting 1760-FCBGA package (42.5 × 42.5 mm) designed for surface-mount assembly to support high-density board designs.
  • Operating Range and Grade Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
  • Documentation and Series Characteristics Electrical and switching characteristics, including transceiver and I/O timing information, are described in the Stratix V device documentation.

Typical Applications

  • High-speed communications and protocol bridging Leverages Stratix V GX device characteristics and high I/O count for multi-channel serial/parallel interface implementations and protocol adaptation.
  • Data processing and hardware acceleration Large logic element count and substantial embedded RAM support custom datapaths, inline processing, and deterministic hardware acceleration tasks.
  • Prototyping and complex system integration Dense programmable fabric and broad I/O capability make the device suitable for validating system architectures and integrating complex peripherals.

Unique Advantages

  • Highly integrated programmable fabric: Nearly 597,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level BOM.
  • Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM enables large buffer and state-storage implementations without external memory.
  • Extensive I/O resources: Up to 600 I/Os provide design flexibility for dense peripheral connectivity and multi-lane interfaces.
  • Compact, surface-mount package: 1760-FCBGA (42.5 × 42.5 mm) supports high-density PCB layouts while maintaining robust mechanical mounting.
  • Commercial-ready specification: Specified core voltage (820–880 mV) and operating temperature range (0 °C to 85 °C) suit commercial product deployments.
  • Standards-compliant supply chain: RoHS compliance aligns with common environmental and manufacturing requirements.

Why Choose 5SGXMB6R3F43C3G?

This Stratix V GX FPGA combines a high-density programmable fabric with substantial embedded RAM and a broad I/O complement to support demanding digital designs that require integration of multiple functions on a single device. Its commercial-grade specification and surface-mount 1760-FCBGA package make it suitable for compact, performance-focused systems where on-chip resources and connectivity are priorities.

Designers building high-speed communications interfaces, custom accelerators, or complex integration platforms will find the 5SGXMB6R3F43C3G provides a scalable, well-documented FPGA option with the on-chip resources needed to minimize external components and streamline system architecture.

If you would like pricing, availability, or a formal quote for 5SGXMB6R3F43C3G, submit a request to receive detailed commercial information and lead-time estimates.

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