5SGXMB6R3F43C3G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 597000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,254 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 225400 | Number of Logic Elements/Cells | 597000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMB6R3F43C3G – Stratix® V GX FPGA, 1760-FCBGA
The 5SGXMB6R3F43C3G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel in a 1760-BBGA FCBGA package. It is a commercial-grade FPGA offering a large programmable fabric, substantial embedded memory, and a high I/O count for complex, high-density digital designs.
Key device parameters include approximately 597,000 logic elements, roughly 53.25 Mbits of on-chip RAM, up to 600 user I/Os, and a specified core supply range of 820 mV to 880 mV. The device is specified for commercial operating temperatures from 0 °C to 85 °C and is RoHS compliant.
Key Features
- Programmable Fabric Approximately 597,000 logic elements to implement large-scale logic, custom datapaths, and complex control logic.
- Embedded Memory Approximately 53.25 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
- I/O Capacity Up to 600 user I/Os to support extensive peripheral connectivity, parallel interfaces, and multi-channel I/O designs.
- Power and Core Supply Core voltage supply specified from 820 mV to 880 mV for the device core.
- Package and Mounting 1760-FCBGA package (42.5 × 42.5 mm) designed for surface-mount assembly to support high-density board designs.
- Operating Range and Grade Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
- Documentation and Series Characteristics Electrical and switching characteristics, including transceiver and I/O timing information, are described in the Stratix V device documentation.
Typical Applications
- High-speed communications and protocol bridging Leverages Stratix V GX device characteristics and high I/O count for multi-channel serial/parallel interface implementations and protocol adaptation.
- Data processing and hardware acceleration Large logic element count and substantial embedded RAM support custom datapaths, inline processing, and deterministic hardware acceleration tasks.
- Prototyping and complex system integration Dense programmable fabric and broad I/O capability make the device suitable for validating system architectures and integrating complex peripherals.
Unique Advantages
- Highly integrated programmable fabric: Nearly 597,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level BOM.
- Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM enables large buffer and state-storage implementations without external memory.
- Extensive I/O resources: Up to 600 I/Os provide design flexibility for dense peripheral connectivity and multi-lane interfaces.
- Compact, surface-mount package: 1760-FCBGA (42.5 × 42.5 mm) supports high-density PCB layouts while maintaining robust mechanical mounting.
- Commercial-ready specification: Specified core voltage (820–880 mV) and operating temperature range (0 °C to 85 °C) suit commercial product deployments.
- Standards-compliant supply chain: RoHS compliance aligns with common environmental and manufacturing requirements.
Why Choose 5SGXMB6R3F43C3G?
This Stratix V GX FPGA combines a high-density programmable fabric with substantial embedded RAM and a broad I/O complement to support demanding digital designs that require integration of multiple functions on a single device. Its commercial-grade specification and surface-mount 1760-FCBGA package make it suitable for compact, performance-focused systems where on-chip resources and connectivity are priorities.
Designers building high-speed communications interfaces, custom accelerators, or complex integration platforms will find the 5SGXMB6R3F43C3G provides a scalable, well-documented FPGA option with the on-chip resources needed to minimize external components and streamline system architecture.
If you would like pricing, availability, or a formal quote for 5SGXMB6R3F43C3G, submit a request to receive detailed commercial information and lead-time estimates.

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