5SGXMB6R3F43C4G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 597000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,040 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 225400 | Number of Logic Elements/Cells | 597000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMB6R3F43C4G – Stratix® V GX FPGA, 597,000 logic elements, ~53 Mbits RAM, 600 I/Os, 1760-FCBGA
The 5SGXMB6R3F43C4G is a Stratix V GX field programmable gate array (FPGA) IC from Intel. It provides a high-density programmable fabric paired with substantial embedded memory and a large I/O count in a 1760-ball FCBGA package for surface-mount applications.
Designed for commercial-grade systems, this device targets applications that require significant logic capacity and on-chip RAM while operating within a 0 °C to 85 °C temperature range and a core supply of 820 mV to 880 mV.
Key Features
- Core Logic Approximately 597,000 logic elements (logic cells) to support complex combinational and sequential logic implementations.
- Embedded Memory Approximately 53 Mbits of total on-chip RAM for data buffering, LUT-based storage, and block memory requirements.
- I/O Density Up to 600 I/O pins to support broad interfacing requirements across parallel and serialized connections.
- Power Core voltage supply range of 820 mV to 880 mV for the programmable fabric.
- Package & Mounting 1760-FCBGA (42.5 × 42.5 mm) package in a surface-mount form factor for compact, high-density board designs.
- Operating Grade Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant for lead-free manufacturing requirements.
Unique Advantages
- High logic density: The large logic element count enables implementation of complex state machines, datapaths, and custom accelerators within a single device.
- Substantial on-chip RAM: Approximately 53 Mbits of embedded memory reduces the need for external memory in many buffering and storage use cases.
- Extensive I/O capability: 600 I/Os accommodate broad system interfacing without immediate need for external expanders.
- Compact, manufacturable package: 1760-FCBGA surface-mount package supports high-density PCB layouts while meeting manufacturing processes.
- Commercial temperature suitability: Rated for 0 °C to 85 °C, aligning with standard commercial product deployment environments.
- Regulatory readiness: RoHS compliance supports lead-free production requirements.
Why Choose 5SGXMB6R3F43C4G?
The 5SGXMB6R3F43C4G combines a high logic element count, substantial embedded RAM, and a large I/O complement in a single commercial-grade Stratix V GX FPGA package. These characteristics make it suitable for designs that need on-chip capacity for complex logic and significant memory without immediately relying on multiple discrete devices.
Its 1760-FCBGA surface-mount package and RoHS compliance support modern assembly processes, while the specified core voltage range and commercial temperature rating help ensure predictable electrical and thermal behavior within the stated operating conditions.
Request a quote or submit an inquiry for 5SGXMB6R3F43C4G to discuss availability, pricing, and integration details for your design requirements.

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