5SGXMB6R3F43I3G

The 5SGXMB6R3F43I3G is a Stratix V GX series FPGA from Intel (Altera) delivering large programmable logic capacity, extensive I/O, and significant on-chip memory for demanding, high-density designs. As a GX-class Stratix V device, it is part of a family that includes high-speed transceiver-capable devices and is offered in industrial temperature grades.

This device is optimized for applications that require a combination of high logic resources, abundant embedded RAM, and a large number of I/O pins, with a compact 1760-FCBGA package and a low-voltage core supply range for power-sensitive systems.

Key Features

• Logic Capacity  Approximately 597,000 logic elements to implement complex digital designs and algorithms.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffering, lookup tables, and on-chip data storage.
• I/O Density  600 user I/O pins to support wide parallel interfaces and dense board-level connectivity.
• Transceiver-Class Device Family  Part of the Stratix V GX family; Stratix V GX devices support GX transceiver speed grades up to 14.1 Gbps (speed varies by device grade).
• Power and Core Voltage  Core supply range of 820 mV to 880 mV to support low-voltage FPGA core operation.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for use in temperature-challenging environments.
• Package and Mounting  1760-ball FCBGA package (1760-FCBGA, 42.5 × 42.5 mm), surface-mount mounting for compact, high-density board designs.
• Compliance  RoHS-compliant for regulatory alignment with lead-free manufacturing requirements.

Typical Applications

• High‑performance data processing  Implement compute-heavy, parallel algorithms and accelerators using large logic and on-chip RAM resources.
• High-speed interfaces and protocol bridges  Use the GX-class transceiver-capable architecture together with 600 I/O pins to support complex interface implementations and board-level bridging.
• Network and communications equipment  Leverage high logic capacity and embedded memory for packet processing, buffering, and real-time data path functions.

Unique Advantages

• High fabric density: Approximately 597,000 logic elements enable large, multi-function designs on a single device, reducing board-level components.
• Substantial on-chip memory: ~53.25 Mbits of embedded RAM supports deep buffering and state storage without external memory in many applications.
• Extensive I/O count: 600 I/O pins provide flexibility for wide buses, parallel interfaces, and multiple peripheral connections.
• Industrial temperature operation: –40 °C to 100 °C rating supports deployment in rugged or temperature-variable environments.
• Low-voltage core operation: Core supply range of 820 mV–880 mV supports power-optimized system designs.
• Compact high-density package: 1760-FCBGA (42.5 × 42.5 mm) enables high integration in space-constrained systems while maintaining signal density.

Why Choose 5SGXMB6R3F43I3G?

The 5SGXMB6R3F43I3G combines large logic capacity, sizeable embedded memory, and a high I/O count in a single industrial-grade Stratix V GX device. Its low-voltage core and high-density FCBGA package make it suitable for designs that demand high integration, significant on-chip storage, and support for high-speed interfaces.

Backed by Intel (Altera) device documentation for the Stratix V family, this FPGA is a fit for engineering teams building complex data-processing, communications, and interface-intensive systems that require robust, scalable FPGA resources.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGXMB6R3F43I3G.