5SGXMB6R3F43C4N

The 5SGXMB6R3F43C4N is a Stratix® V GX field-programmable gate array supplied in a 1760-FCBGA (42.5 × 42.5 mm) package. This commercial-grade FPGA offers very high logic capacity and on-chip memory, combined with a large I/O count and low-voltage core operation.

Designed for applications that require extensive programmable logic and dense I/O, this device provides a platform for complex system integration where high logic and memory resources are primary design drivers.

Key Features

• Core Logic — 597,000 logic elements providing high-density programmable logic for complex designs and large-scale integration.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support data buffering, large state machines, and memory-intensive logic functions.
• I/O Capacity — 600 general-purpose I/Os enabling extensive external interfacing and high pin-count system designs.
• Package — 1760-FCBGA (42.5 × 42.5 mm) surface-mount package (Package Case: 1760-BBGA, FCBGA) suited for compact, high-density board layouts.
• Power — Core voltage supply range of 820 mV to 880 mV to match system power-rail planning for modern FPGA power domains.
• Temperature & Grade — Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Mounting & Compliance — Surface-mount device; RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• High-density digital systems — Implement large-scale logic and control functions where extensive logic elements and embedded RAM are required.
• High-pin-count interfacing — Drive complex multi-device systems or board-level bridges that benefit from up to 600 I/Os.
• Prototyping and system integration — Use as a commercial-grade development platform for validating large designs before deployment.

Unique Advantages

• High logic and memory capacity: 597,000 logic elements and ~53.25 Mbits of embedded RAM enable integration of large functional blocks on a single device, reducing system complexity.
• Extensive external connectivity: 600 I/Os allow broad peripheral and bus interfacing without additional I/O expansion components.
• Compact high-pin-count package: 1760-FCBGA (42.5 × 42.5 mm) delivers high interconnect density in a surface-mount form factor suited for dense PCB layouts.
• Low-voltage core operation: Core supply range of 820–880 mV supports modern low-voltage power domains and efficient power delivery planning.
• Regulatory readiness: RoHS compliance facilitates integration into designs targeting global electronics markets.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation for mainstream embedded and industrial-adjacent applications.

Why Choose 5SGXMB6R3F43C4N?

The 5SGXMB6R3F43C4N positions itself where high logic density, substantial on-chip memory, and abundant I/O are key to system success. Its combination of 597,000 logic elements, approximately 53.25 Mbits of embedded RAM, and 600 I/Os supports consolidation of complex subsystems into a single FPGA die, simplifying board-level design and reducing component count.

This Stratix V GX device is well suited to engineering teams and procurement looking for a commercial-grade, high-capacity FPGA platform for prototyping, integration, and deployment in systems that operate within a 0 °C to 85 °C range and require RoHS-compliant components.

Request a quote or submit an inquiry to receive pricing and availability for 5SGXMB6R3F43C4N. Provide your quantity and any required lead-time information to expedite our response.