5SGXMB9R1H43C2G

The 5SGXMB9R1H43C2G is an Intel Stratix V GX field programmable gate array designed for high-density programmable logic integration. This commercial-grade FPGA delivers a large available logic resource set, substantial on-chip memory, and extensive I/O, packaged in a 1760-ball BGA suitable for surface-mount assembly.

Targeted at applications that require significant programmable logic, embedded memory, and broad I/O counts, the device is specified for operation within a commercial temperature range and low-voltage core supply boundaries for power-managed designs.

Key Features

• Logic Capacity  Approximately 840,000 logic elements, providing high design density for complex digital functions.
• Embedded Memory  Approximately 53.25 Mbits (53,248,000 bits) of on-chip RAM for buffering, state storage, and embedded data structures.
• I/O  600 user I/O pins to support wide parallel interfaces and multiple external peripherals.
• Package & Mounting  1760-BBGA, FCBGA package (supplier device package: 1760-HBGA (45×45)), designed for surface-mount PCB assembly.
• Power Supply  Core voltage range specified at 870 mV to 930 mV to match low-voltage power architectures.
• Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.
• Stratix V Family Documentation  Device electrical and switching characteristics—including core, periphery, I/O timing, and transceiver-level details—are documented in the Stratix V device datasheet.

Unique Advantages

• High-density programmable logic: The large logic element count enables consolidation of complex RTL and system functions into a single device, reducing board-level component count.
• Significant on-chip memory: Tens of megabits of embedded RAM simplify data buffering and stateful processing without external memory for many designs.
• Extensive I/O capability: 600 I/Os support broad external connectivity and multi‑lane parallel interfaces, enabling flexible system integration.
• Compact BGA packaging: The 1760-ball FCBGA/HBGA package provides a balance of high pin count and PCB area efficiency for space-constrained designs.
• Commercial temperature suitability: Specified 0 °C to 85 °C operation for a wide range of commercial embedded applications.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and supply-chain requirements.

Why Choose 5SGXMB9R1H43C2G?

The 5SGXMB9R1H43C2G positions itself as a high-density Stratix V GX FPGA option for teams needing substantial logic resources, on-chip memory, and large I/O counts in a surface-mount BGA package. With a defined commercial temperature range and precise core voltage window, it fits designs that require predictable electrical and thermal envelopes.

For development and integration, the device is supported by Stratix V family documentation covering electrical and switching characteristics, helping engineering teams validate timing, power, and I/O requirements against project constraints.

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