5SGXMB9R1H43I2N

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA

Quantity 716 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB9R1H43I2N – Stratix V GX FPGA – 840,000 logic elements, ≈53.25 Mbits embedded memory, 600 I/Os, 1760-BBGA (FCBGA)

The 5SGXMB9R1H43I2N is a Stratix V GX field programmable gate array (FPGA) IC from Intel, offered in a 1760-BBGA (FCBGA) package. It delivers very high logic density and on-chip memory capacity, along with a large I/O count and industrial temperature grade for rugged applications.

As a member of the Stratix V GX family, the device is documented in the Stratix V device datasheet and is suitable for designs that require extensive programmable logic, substantial embedded RAM, and a high number of external I/Os.

Key Features

  • Core logic capacity — 840,000 logic elements (cells) to implement complex digital designs and large-scale architectures.
  • Embedded memory — Approximately 53.248 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic functions.
  • High I/O count — 600 I/Os to support dense external interfaces and multi-channel connectivity.
  • Transceiver family capability — As a Stratix V GX device, the family supports GX transceiver channel speed grades documented in the series datasheet.
  • Power and supply — Core supply voltage range from 870 mV to 930 mV, allowing defined core supply planning.
  • Industrial temperature grade — Rated for operation from –40°C to 100°C for deployment in temperature-challenging environments.
  • Package and mounting — Surface-mount 1760-BBGA (FCBGA) package, supplier device package listed as 1760-HBGA (45×45) for PCB footprint planning.
  • Regulatory status — RoHS compliant.

Typical Applications

  • High-speed networking and switching — Use the device’s high logic density and family transceiver capabilities to implement packet processing, line cards, and multi-gigabit interfaces.
  • Advanced signal processing — Large embedded RAM and extensive logic resources enable DSP algorithms, multicast buffering, and complex pipeline implementations.
  • Prototype and system integration — High I/O count and dense logic make the device suitable for complex prototype platforms and system-level integration tasks.
  • Industrial control and automation — Industrial temperature rating and robust package options support deployment in industrial equipment requiring programmable logic and numerous external connections.

Unique Advantages

  • Highly integrated logic and memory: 840,000 logic elements and ≈53.25 Mbits of embedded memory reduce external component needs for large designs.
  • Extensive external connectivity: 600 I/Os enable broad peripheral interfacing and simultaneous multi-channel I/O usage.
  • Industrial temperature operation: Rated from –40°C to 100°C for reliable operation across a wide thermal range.
  • Defined core supply window: 870 mV–930 mV core voltage simplifies power-supply selection and design validation.
  • Compact FCBGA package: 1760-BBGA (1760-HBGA, 45×45) provides a dense mounting option for board-level integration.
  • RoHS compliant: Supports regulatory and environmental requirements for electronic assemblies.

Why Choose 5SGXMB9R1H43I2N?

The 5SGXMB9R1H43I2N positions itself for demanding programmable-logic designs that require a combination of very high logic capacity, substantial embedded RAM, and a high number of I/Os in an industrial-grade package. Its core supply range and thermal rating make it suitable for engineered systems that must meet defined electrical and environmental constraints.

Engineers and system designers who need scalable logic resources, significant on-chip memory, and robust I/O capabilities will find this Stratix V GX device appropriate for advanced networking, signal processing, prototyping, and industrial control applications. Technical details and operating characteristics for the Stratix V family are available in the Stratix V device datasheet.

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