5SGXMB9R2H43C2G

The 5SGXMB9R2H43C2G is a Stratix® V GX field programmable gate array (FPGA) IC from Intel. It provides high-density programmable logic combined with substantial embedded memory and a high I/O count to address complex digital designs.

With 840,000 logic elements, approximately 53.2 Mbits of embedded memory and support for up to 600 I/O signals, this commercial‑grade, surface‑mount device is suited for designs that require large logic capacity, extensive on-chip RAM and dense board-level connectivity.

Key Features

• Core logic density — 840,000 logic elements for large-scale programmable logic integration.
• Embedded memory — Total on-chip RAM of 53,248,000 bits (approximately 53.2 Mbits) to support data buffering and state storage.
• I/O capability — Up to 600 user I/O pins to accommodate high signal-count systems and dense peripheral connectivity.
• Package and mounting — 1760‑BBGA FCBGA package (supplier device package: 1760‑HBGA, 45×45) for high pin‑count, surface‑mount PCB designs.
• Power requirements — Core voltage supply range of 870 mV to 930 mV for defined power and timing design margins.
• Operating conditions — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

• High‑density FPGA designs — Use where a large logic resource (840,000 logic elements) is required to implement complex digital functions.
• Memory‑intensive logic — Designs that need significant on‑chip RAM, leveraging approximately 53.2 Mbits of embedded memory for buffering and state machines.
• I/O‑heavy systems — Applications requiring many external interfaces or parallel I/O lines, supported by up to 600 I/O pins.
• Compact, high‑pin‑count boards — Surface‑mount 1760‑BBGA / 1760‑HBGA packaging for dense board layouts and high interconnect count.

Unique Advantages

• Substantial programmable capacity: 840,000 logic elements enable consolidation of large functions into a single FPGA device.
• Significant on‑chip memory: Approximately 53.2 Mbits of embedded RAM reduces reliance on external memory for many mid‑to‑large data buffering tasks.
• High I/O density: 600 available I/O pins support extensive external connectivity without immediate need for additional I/O expanders.
• High‑pin, surface‑mount packaging: 1760‑BBGA (1760‑HBGA supplier package) optimizes board area for high-density system designs.
• Tight core voltage specification: Defined 870 mV–930 mV supply range aids in predictable power delivery and timing characterization.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for typical commercial applications.

Why Choose 5SGXMB9R2H43C2G?

This Stratix® V GX FPGA combines a high logic cell count, large on‑chip RAM and a high I/O count in a single commercial‑grade package, making it appropriate for complex, high‑integration designs that require substantial programmable resources. The device’s defined power and thermal characteristics simplify system-level planning for board and power supply design.

Engineers targeting designs that need consolidated logic, significant embedded memory, and dense peripheral connectivity will find the 5SGXMB9R2H43C2G well suited to those requirements while benefiting from Intel’s Stratix V GX family infrastructure and documentation.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGXMB9R2H43C2G.