5SGXMB9R2H43I2G

The 5SGXMB9R2H43I2G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1760‑ball BGA package. This high‑density, industrial‑grade device integrates a large logic fabric, substantial on‑chip RAM, and a wide I/O count to support complex, compute‑intensive designs.

As part of the Stratix V GX family, the device aligns with series electrical and switching characteristics documented for Stratix V devices. It is intended for industrial applications requiring high logic capacity, significant embedded memory, and extended operating temperature range.

Key Features

• High logic density — 840,000 logic elements and 317,000 LABs provide substantial programmable resources for large FPGA designs.
• Embedded memory — approximately 53.25 Mbits of total on‑chip RAM to support large buffers, FIFOs, and memory‑intensive logic functions.
• Extensive I/O — 600 I/O pins to accommodate complex board-level interfacing and multi‑lane connectivity.
• Industrial temperature range — rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• Core voltage — documented supply range of 870 mV to 930 mV for the device core.
• Package and mounting — supplied in a 1760‑BBGA (FCBGA) package; supplier device package listed as 1760‑HBGA (45×45); surface‑mount type for standard PCB assembly.
• RoHS compliant — meets RoHS requirements for environmental compliance.

Unique Advantages

• Large programmable fabric: 840,000 logic elements enable consolidation of complex functions into a single device, reducing system BOM and board complexity.
• Generous on‑chip memory: approximately 53.25 Mbits of embedded RAM supports deep buffering and data‑intensive processing without external memory.
• Broad I/O capacity: 600 I/Os provide flexibility for high‑pin‑count interfaces and dense connectivity to peripherals or multi‑lane bus architectures.
• Industrial reliability: −40 °C to 100 °C operating range and industrial grade classification support deployment in harsh and temperature‑variable environments.
• Compact, assembly‑ready package: 1760‑ball BGA packaging with surface‑mount mounting simplifies integration into modern PCB layouts while supporting high pin count.
• Controlled core supply: specified core voltage range (870–930 mV) enables predictable power design and integration with regulated power rails.

Why Choose 5SGXMB9R2H43I2G?

The 5SGXMB9R2H43I2G delivers a combination of high logic density, substantial embedded memory, and extensive I/O in an industrial‑grade Stratix V GX device. Its specifications — including 840,000 logic elements, approximately 53.25 Mbits of on‑chip RAM, 600 I/Os, and a wide operating temperature range — make it suitable for complex FPGA designs that require consolidation of functions, robust memory resources, and reliable operation in challenging environments.

Backed by Intel’s Stratix V device documentation, this device is well suited for engineering teams targeting high‑capacity, industrial applications that demand scalable logic resources and predictable electrical characteristics.

If you would like pricing or availability, request a quote or submit a parts inquiry to receive a formal quotation and procurement details for 5SGXMB9R2H43I2G.