5SGXMB9R2H43I2N

The 5SGXMB9R2H43I2N is a Stratix V GX field‑programmable gate array (FPGA) device designed for high‑density, high‑I/O digital designs. This industrial‑grade, surface‑mount FCBGA device integrates 840,000 logic elements and approximately 53.2 Mbits of on‑chip RAM to address applications requiring large programmable logic fabrics and substantial embedded memory.

With a 600‑pin I/O count, dedicated support for high‑performance transceiver features described in the Stratix V GX family datasheet, and a low‑voltage core supply range, this device targets system designs that demand integration, high channel counts, and reliable operation across an extended temperature range.

Key Features

• Logic Capacity — 840,000 logic elements to implement large-scale logic, control, and datapath functions within a single device.
• Embedded Memory — Approximately 53.2 Mbits of on‑chip RAM providing deep buffering and storage for packet processing, frame buffering, or algorithm state storage.
• High I/O Count — 600 user I/O pins to support extensive peripheral connectivity and parallel interfaces.
• Transceiver and Switching Support — Designed as a Stratix V GX device family member with transceiver and switching characteristics documented in the Stratix V device datasheet for serial channel and I/O timing requirements.
• Power and Supply — Core supply range from 870 mV to 930 mV for devices in this family, enabling targeted power delivery and regulation designs.
• Package and Mounting — 1760‑BBGA FCBGA package (supplier package listed as 1760‑HBGA, 45×45) in a surface‑mount form factor for compact system integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet extended temperature requirements.
• RoHS Compliant — Conforms to RoHS requirements for lead‑free soldering and environmental compliance.

Typical Applications

• High‑performance networking and communications — Utilize the device’s large logic capacity, extensive on‑chip RAM, and Stratix V GX transceiver capabilities for packet processing, switching, and protocol offload functions.
• Compute and acceleration — Implement custom accelerators and large datapaths using the high logic element count and abundant embedded memory for buffering and intermediate storage.
• Large‑scale prototyping and system integration — Support comprehensive prototype systems or integration platforms that require many I/Os and high logic density in a single FPGA package.

Unique Advantages

• High logic density: 840,000 logic elements reduce the need for multi‑device partitioning and simplify board‑level design.
• Substantial on‑chip RAM: Approximately 53.2 Mbits of embedded memory supports deep buffering and stateful processing without immediate external memory dependency.
• Extensive I/O capability: 600 I/O pins enable wide parallel interfaces and flexible peripheral connectivity for complex system designs.
• Industrial thermal range: Rated from −40 °C to 100 °C for deployment in environments with wider ambient temperature swings.
• Compact, surface‑mount FCBGA package: 1760‑BBGA footprint (45×45 supplier package) allows dense board integration while maintaining high pin count.
• Low‑voltage core operation: Core supply between 870 mV and 930 mV aligns with modern power‑delivery approaches for efficient core management.

Why Choose 5SGXMB9R2H43I2N?

The 5SGXMB9R2H43I2N delivers a combination of large programmable logic capacity, substantial embedded RAM, and a high I/O count in an industrial‑rated Stratix V GX FPGA package. These characteristics make it suitable for system designs that require consolidated logic, deep on‑chip memory resources, and flexible interfacing in a single‑chip solution.

Its package and supply requirements support compact, high‑density system layouts and targeted power‑delivery architectures, while the documented Stratix V GX device family electrical and switching characteristics provide the reference information needed to integrate the device into performance‑focused designs.

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