5SGXMB9R2H43I3N

The 5SGXMB9R2H43I3N is an Intel Stratix V GX field‑programmable gate array supplied in a 1760‑ball BGA (FCBGA) package. It provides high logic density and on‑chip RAM along with a large programmable I/O count, making it suitable for complex digital designs in industrial temperature environments. The device is part of the Stratix V GX family and is documented in the Stratix V device datasheet.

Key Features

• Core & logic  Approximately 840,000 logic elements for large, consolidated digital designs and high integration of custom logic functions.
• Embedded memory  Approximately 53.25 Mbits of on‑chip RAM to support buffering, packet storage, and wide datapath implementations.
• I/O capacity  600 available I/O pins to support extensive peripheral, memory, and high‑speed interface connectivity.
• Transceiver family support (Stratix V GX)  Stratix V GX devices include transceiver speed grades; the family documentation lists GX channel options (for example, GX channel—14.1 Gbps and 12.5 Gbps) as part of the Stratix V device specification set.
• Power  Core supply rating from 820 mV to 880 mV as specified for the device operating conditions.
• Package & mounting  1760‑BBGA (FCBGA) package; supplier device package listed as 1760‑HBGA (45×45). Surface‑mount mounting type.
• Operating range  Industrial temperature grade with operating temperature from −40 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑performance networking  Leverage the large logic capacity and high I/O count for packet processing, switching fabric, and protocol offload functions.
• Signal processing and compute acceleration  Use abundant logic elements and embedded RAM for streaming DSP, datapath acceleration, and algorithm implementation.
• Telecommunications and backplane interfaces  Stratix V GX transceiver options and extensive I/O support enable physical layer and protocol bridging applications.
• Industrial control and instrumentation  Industrial temperature rating and high integration density suit demanding control, motion, and measurement systems.

Unique Advantages

• High logic density:  Approximately 840,000 logic elements enable consolidation of multiple functions into a single device, reducing system BOM and board area.
• Substantial on‑chip memory:  Approximately 53.25 Mbits of embedded RAM supports large buffering and complex state machines without external memory.
• Large I/O complement:  600 I/O pins provide flexibility for parallel interfaces, memory buses, and multi‑lane connectivity.
• Industrial temperature capability:  Rated for −40 °C to 100 °C operation for demanding environmental deployments.
• Compact BGA package:  1760‑ball FCBGA form factor (45×45 supplier package) balances high pin count and board density for space‑constrained systems.
• Documented transceiver options:  Part of the Stratix V GX family, which includes defined transceiver speed grades in the device datasheet for high‑speed link design planning.

Why Choose 5SGXMB9R2H43I3N?

The 5SGXMB9R2H43I3N delivers substantial programmable logic, significant embedded memory, and a high I/O count in a single industrial‑rated Stratix V GX device. Its specified core supply range and documented transceiver capabilities make it suitable for complex communications, compute acceleration, and industrial control applications where integration and environmental robustness are required. Designers seeking a high‑density, high‑I/O FPGA solution documented in the Stratix V device datasheet will find this device well suited for scalable, long‑lifecycle designs.

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