5SGXMB9R2H43I3G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 744 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-HBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMB9R2H43I3G – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXMB9R2H43I3G is a Stratix V GX FPGA in a 1760-BBGA FCBGA package designed for high-density, programmable logic integration. It combines 840,000 logic elements with approximately 53.25 Mbits of embedded memory and up to 600 I/O to address complex digital, signal-processing, and high-speed interfacing requirements.
Specified for industrial operation and a low-voltage core supply, this device targets designs that require large logic capacity, substantial on-chip RAM, and robust I/O while maintaining a compact surface-mount package and RoHS compliance.
Key Features
- Core Logic 840,000 logic elements deliver large-scale programmable logic resources for complex custom hardware functions.
- Embedded Memory Approximately 53.25 Mbits of on-chip RAM to support buffering, FIFOs, and data-path implementations.
- I/O Density Up to 600 I/O pins for wide external interfacing and dense system integration.
- Power Core voltage supply range of 820 mV to 880 mV for the device core to support low-voltage design domains.
- Package & Mounting 1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45). Surface-mount mounting type for compact board-level integration.
- Temperature & Grade Industrial-grade operation with an operating temperature range of –40 °C to 100 °C.
- Standards & Compliance RoHS-compliant material design.
- Series Transceiver Options (Series-level) Stratix V GX family device datasheet documents transceiver speed grades for the series (for example, GX channel speeds referenced in the series datasheet), enabling high-speed serial channel capability at the series level.
Typical Applications
- High-speed communications and networking Use the device’s high logic capacity and series transceiver options for complex packet processing and line-rate interfaces.
- Signal processing and acceleration Leverage abundant logic elements and on-chip RAM for DSP algorithms, filtering, and custom acceleration engines.
- Data-center and compute Implement custom compute blocks and data-paths where large programmable fabric and dense I/O are required.
Unique Advantages
- High integration density: 840,000 logic elements and substantial embedded RAM reduce the need for external logic and memory, simplifying system BOMs.
- Robust industrial operation: Rated for –40 °C to 100 °C operation to support industrial deployments.
- Dense external connectivity: 600 I/O pins enable complex interfacing and multi-channel system designs without extensive external multiplexing.
- Compact, high-pin-count package: 1760-BBGA (FCBGA) package delivers high pin-count in a compact surface-mount form factor for board-space-constrained applications.
- Low-voltage core: Core supply range of 820–880 mV supports designs targeting low-voltage power domains.
- RoHS compliance: Aligns with environmental and manufacturing requirements for lead-free production.
Why Choose 5SGXMB9R2H43I3G?
This Stratix V GX FPGA offers a combination of large programmable logic capacity, significant on-chip memory, and a high I/O count in a compact FCBGA package—making it suitable for demanding digital designs that require both scale and density. Its industrial temperature rating and RoHS compliance support deployment in controlled industrial environments where reliability and regulatory compliance matter.
Engineers and system designers seeking a scalable, high-capacity FPGA fabric with substantial embedded RAM and extensive interfacing options will find the 5SGXMB9R2H43I3G appropriate for complex communications, signal-processing, and custom compute applications.
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