5SGXMB9R3H43C2LG

The 5SGXMB9R3H43C2LG is a Stratix V GX Field Programmable Gate Array (FPGA) IC designed for high-density logic and embedded memory applications. It combines a large logic fabric, substantial on-chip RAM, and a broad I/O count in a 1760-BBGA (FCBGA) package for integration into complex digital systems.

Targeted at commercial-temperature applications, this device is suited for designs that require significant programmable logic capacity, wide I/O connectivity, and support for Stratix V GX transceiver speed grades as documented in the device datasheet.

Key Features

• Core & Logic — 840,000 logic elements provide extensive programmable logic capacity for complex algorithms and large-scale state machines.
• Logic Array Blocks — 317,000 logic array blocks (LABs/CLBs reported in device data) for structured logic partitioning and resource planning.
• Embedded Memory — Approximately 53 Mbits of on-chip RAM to support buffering, DSP data storage, and large LUTRAM implementations.
• I/O Density — 600 available I/O pins to accommodate wide parallel interfaces, multiple peripheral buses, or extensive board-level connectivity.
• High-speed Transceivers — Stratix V GX transceiver speed grades are documented in the datasheet (GX channel listings include speeds up to 14.1 Gbps), enabling high-bandwidth serial links where required.
• Power & Supply — Core supply voltage range from 820 mV to 880 mV for planning power delivery and regulator selection.
• Package & Mounting — 1760-BBGA, FCBGA package (supplier package listed as 1760-HBGA, 45 × 45 mm) for surface-mount PCB integration with high I/O density.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-density signal processing — Use the large pool of logic elements and abundant on-chip RAM for DSP pipelines, video processing, and real-time data manipulation.
• Network and communications equipment — Leverage the Stratix V GX transceiver speed grades and 600 I/Os for high-bandwidth serial links, protocol bridging, and packet processing.
• Prototyping and complex SoC integration — Implement custom accelerators, bus fabrics, and system glue logic with the device’s extensive logic and memory resources.

Unique Advantages

• Large programmable fabric: 840,000 logic elements enable consolidation of multi-module designs into a single FPGA, reducing external components.
• Substantial embedded memory: Approximately 53 Mbits of on-chip RAM minimizes external memory dependence and improves system latency.
• High I/O count: 600 I/Os give flexibility to connect multiple parallel interfaces or mix high-speed serial and parallel peripherals on one device.
• Documented transceiver capability: GX transceiver speed grades are specified in the Stratix V datasheet, supporting high-bandwidth link designs when required.
• Commercial temperature operation: Rated 0 °C to 85 °C for standard commercial deployments and system integration planning.
• RoHS compliant: Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose 5SGXMB9R3H43C2LG?

The 5SGXMB9R3H43C2LG offers a combination of expansive logic resources, significant embedded memory, and high I/O density in a single Stratix V GX device. Its specifications make it a practical option for engineers designing complex digital systems that require on-chip capacity for logic, buffering, and high-bandwidth I/O.

Backed by the Stratix V device documentation, this part is appropriate for commercial-temperature deployments where deterministic FPGA resources and documented transceiver speed grades are required. It provides a scalable platform for integrating compute-heavy or I/O-intensive functions while simplifying board-level architecture.

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