A3P250-2FG144

The A3P250-2FG144 is a ProASIC3 field programmable gate array (FPGA) IC designed for commercial embedded applications. It integrates 6,144 logic elements, approximately 36.9 kbits of on-chip RAM and 97 I/O in a compact 144-LBGA package to deliver a balanced combination of logic capacity and I/O density.

This device targets designs that require configurable digital logic with defined supply and thermal ranges—featuring a core voltage range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C—while maintaining RoHS compliance and surface-mount mounting for modern PCB assembly.

Key Features

• Core Logic  6,144 logic elements (LAB/CLB equivalent) providing a usable logic fabric and an approximate gate count of 250,000 for implementing moderate-density designs.
• On‑Chip Memory  Approximately 36.9 kbits (36,864 bits) of embedded RAM for small buffers, FIFOs and state storage directly inside the device.
• I/O Density  97 user I/O pins to support a wide range of peripheral interfaces and board-level interconnect requirements.
• Supply and Thermal  Defined core voltage range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C suitable for commercial applications.
• Package & Mounting  144-LBGA package (supplier device package: 144-FPBGA, 13×13) with surface-mount mounting for space-efficient PCB integration.
• Regulatory  RoHS compliant, supporting modern environmental and manufacturing requirements.
• Grade  Commercial grade component intended for general-purpose embedded systems and commercial products.

Typical Applications

• Commercial embedded systems  Use where a compact FPGA with 6,144 logic elements and 97 I/O supports peripheral control, glue logic or protocol bridging within a commercial product.
• Board-level I/O expansion  Deploy as a dedicated logic device to add customizable I/O handling and signal aggregation on space-constrained PCBs using the 144-LBGA package.
• Prototyping and evaluation  Suitable for evaluating moderate-density FPGA implementations that require on-chip memory and a clearly defined supply and temperature envelope.

Unique Advantages

• Balanced logic-to-I/O ratio: 6144 logic elements paired with 97 I/O pins enables efficient mapping of medium-complexity logic functions without oversizing the device.
• Compact LBGA footprint: The 144-LBGA (13×13) package helps minimize board area while providing adequate I/O count for many commercial designs.
• Defined electrical operating window: A narrow core voltage range (1.425 V–1.575 V) simplifies power-supply planning and helps ensure consistent device behavior within specified limits.
• On-chip RAM for local buffering: Approximately 36.9 kbits of embedded memory reduces external memory needs for small FIFO/buffer tasks and state storage.
• RoHS compliant and surface mount: Meets common environmental standards and is compatible with standard surface-mount assembly processes.

Why Choose A3P250-2FG144?

The A3P250-2FG144 offers a practical balance of logic resources, embedded memory and I/O in a compact commercial-grade LBGA package. Its specification set—6,144 logic elements, roughly 36.9 kbits of on-chip RAM, 97 I/O, and a clear supply/temperature window—makes it well suited for designers who need a configurable logic device for commercial embedded applications with controlled power and thermal requirements.

For teams seeking a straightforward FPGA integration with RoHS compliance and surface-mount packaging, the A3P250-2FG144 provides predictable electrical and mechanical characteristics that simplify board-level design and procurement.

Request a quote or submit a purchasing inquiry to obtain pricing and lead-time information for the A3P250-2FG144. Our team can provide availability and help with order placement.