A3P250-2FG256I

The A3P250-2FG256I is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial-grade embedded designs. It integrates 6,144 logic elements, approximately 36,864 bits of on-chip RAM and 157 user I/O to implement custom digital logic in a compact 256-LBGA package.

This device is targeted at industrial applications that require a balance of integration, I/O density and a wide operating temperature range, with a low-voltage core supply that supports compatible system power rails.

Key Features

• Logic Capacity 6,144 logic elements (cells) provide resources for implementing custom digital functions and control logic.
• Embedded Memory 36,864 bits of total on-chip RAM for data buffering, state storage and small memory structures.
• I/O Density 157 user I/O pins to support multiple interfaces and peripheral connections in a single device.
• Gate Equivalent Approximately 250,000 gates for sizing and partitioning of logic designs.
• Voltage Core supply range of 1.425 V to 1.575 V to match low-voltage system requirements.
• Package 256-LBGA / 256-FPBGA (17×17 mm) surface-mount package for high pin-density board implementations.
• Industrial Temperature Range Rated for operation from −40°C to 100°C for demanding environmental conditions.
• Mounting & Compliance Surface-mount device with RoHS compliance for modern assembly and environmental requirements.

Typical Applications

• Industrial Control Use the device’s logic capacity and I/O count to implement custom control functions and interface multiple sensors and actuators.
• Embedded Data Processing Leverage on-chip RAM and logic elements for buffering, protocol handling and small-data processing tasks.
• Interface Aggregation Consolidate multiple peripheral interfaces or custom glue logic into a single FPGA to reduce board complexity.

Unique Advantages

• Compact, High-Pin Package: 256-LBGA package provides high I/O count in a small footprint, simplifying PCB routing and density management.
• Industrial Temperature Rating: Specified for −40°C to 100°C operation to meet harsher environment requirements without additional components.
• Integrated Logic and RAM: Combines 6,144 logic elements with on-chip RAM to reduce the need for external memory and decrease BOM complexity.
• Low-Voltage Core: Narrow core supply range (1.425 V–1.575 V) aligns with low-voltage system power architectures for efficient integration.
• RoHS Compliant: Meets regulatory requirements for lead-free assembly and broader regulatory acceptance.

Why Choose A3P250-2FG256I?

The A3P250-2FG256I positions itself as a compact, industrial-grade FPGA option combining a substantial logic element count, embedded memory and a high I/O count in a 256-LBGA package. Its operating temperature range and RoHS compliance make it suitable for sustained use in industrial environments where robustness and regulatory compliance are required.

This device is well suited for engineering teams needing to consolidate discrete logic and interface functions into a single programmable device, offering scalability within designs that require moderate gate count and dedicated I/O resources.

Request a quote or submit an inquiry to our sales team to discuss availability, pricing and how the A3P250-2FG256I can fit into your next embedded design.