A3P250-2FGG256I

The A3P250-2FGG256I is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology providing 6,144 logic elements and 157 user I/O pins in a 256-LBGA package. It delivers an integrated FPGA building block for designs that require on-chip logic, configurable I/O and embedded RAM.

Specified for industrial use, this device supports an operating temperature range of -40 °C to 100 °C and a core voltage supply range of 1.425 V to 1.575 V, making it suitable for applications that need consistent operation across extended temperature ranges.

Key Features

• Core Logic 6,144 logic elements (cells) providing up to 250,000 gates of user-configurable logic resources.
• Embedded Memory Approximately 0.037 Mbits of embedded memory (36,864 total RAM bits) for on-chip data storage and buffering.
• I/O Capacity 157 user I/O pins to support multiple external interfaces and parallel signal routing.
• Power Supply Core voltage supply specified from 1.425 V to 1.575 V for predictable power behavior within the defined range.
• Package & Mounting Surface-mount 256-LBGA package (supplier device package: 256-FPBGA, 17 × 17 mm) for compact board-level integration.
• Industrial Temperature Rating Rated for operation from -40 °C to 100 °C to meet industrial thermal requirements.
• Regulatory Compliance RoHS-compliant construction for conformity with lead-free manufacturing requirements.

Unique Advantages

• Substantial Logic Density: 6,144 logic elements enable implementation of complex custom logic functions without external ASICs.
• Ample I/O Flexibility: 157 I/Os support diverse peripheral and interface requirements directly at the FPGA edge.
• On‑Chip RAM: Approximately 0.037 Mbits of embedded memory reduces reliance on external RAM for small buffers and state storage.
• Industrial Reliability: Specified -40 °C to 100 °C operation provides predictable behavior across extended temperature ranges.
• Compact, Surface-Mount Package: 256-LBGA (256-FPBGA, 17 × 17) enables high-density board layouts and automated assembly.
• Regulatory Readiness: RoHS compliance supports lead-free production processes.

Why Choose A3P250-2FGG256I?

The A3P250-2FGG256I positions itself as an industrial-grade FPGA option that balances sizable programmable logic resources, embedded memory, and a high I/O count within a compact 256-LBGA package. Its defined voltage range and wide operating temperature rating support stable integration into designs that require predictable electrical and thermal behavior.

This device is well suited for engineers and procurement teams seeking a Microchip FPGA offering clear specification points—logic capacity, I/O, embedded RAM, package details, and industrial temperature capability—to support mid-density programmable logic needs while maintaining RoHS compliance.

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