A3P250-2PQ208I

The A3P250-2PQ208I is a ProASIC3 field programmable gate array (FPGA) offered in a 208-BFQFP surface-mount package. It provides 6,144 logic elements and approximately 0.037 Mbits (36,864 bits) of on-chip RAM, together with 151 user I/Os and an internal gate capacity of 250,000 gates.

Designed for industrial-grade applications, this device operates over a wide temperature range and a defined supply voltage window, making it suitable for embedded systems and industrial electronic equipment that require configurable digital logic and substantial I/O integration.

Key Features

• Core Logic  6,144 logic elements and 250,000 gates enable implementation of custom digital logic and moderate-complexity designs.
• On-Chip Memory  36,864 bits (approximately 0.037 Mbits) of embedded RAM for data buffering, small FIFOs, and state storage.
• I/O Capacity  151 user I/Os provide broad interfacing capability for multiple peripherals and signals in a single device.
• Power Supply  Operates from a defined core voltage range of 1.425 V to 1.575 V for predictable power domain requirements.
• Package and Mounting  208-BFQFP (supplier device package: 208-PQFP 28×28) in a surface-mount form factor for board-level integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control and Automation  Use the device's logic capacity and I/O count to implement control logic and I/O aggregation in industrial equipment.
• Embedded System Integration  Deploy the FPGA for custom glue logic, protocol interfacing, and on-board processing in embedded products.
• Communication and I/O Interfaces  Leverage the 151 I/Os and on-chip memory to implement interface bridging, buffering, and signal management within electronic systems.

Unique Advantages

• Ample Logic Resources: 6,144 logic elements and 250,000 gates support substantial custom logic implementation without external ASICs.
• Integrated On-Chip RAM: 36,864 bits of embedded memory enable local data buffering and state storage for deterministic behavior.
• Broad I/O Count: 151 user I/Os simplify system design by accommodating multiple peripherals and signals on a single device.
• Industrial-Grade Operation: Rated from −40 °C to 100 °C to meet the environmental requirements of industrial deployments.
• Compact Surface-Mount Package: 208-BFQFP (28×28 PQFP) offers a space-efficient footprint for PCB designs.
• Defined Supply Window: Narrow core voltage range (1.425–1.575 V) supports consistent power delivery and system planning.

Why Choose A3P250-2PQ208I?

The A3P250-2PQ208I positions itself as a configurable logic device that balances logic density, on-chip memory, and I/O capacity in an industrial-grade package. Its specification set is well suited to engineers designing embedded and industrial electronic systems that require consolidated logic, buffering, and multi-signal interfacing.

With a standardized package and defined electrical and thermal operating ranges, this FPGA supports durable, maintainable designs and straightforward integration into existing hardware platforms. The RoHS-compliant qualification further supports contemporary manufacturing requirements.

Request a quote or submit an inquiry to start the procurement process for A3P250-2PQ208I and evaluate how its logic resources, memory, and I/O can fit your design requirements.